On August 16, Grail announced its semi-annual report. The company achieved revenue of 1.497 billion yuan during the reporting period, a year-on-year increase of 21.23%, and achieved a net profit attributable to shareholders of listed companies of 0.43 billion yuan, a year-on-year increase of 15.65%. At the same time, it achieved a net profit attributable to shareholders of listed companies after deducting non-recurring gains and losses of 0.368 billion yuan, a year-on-year increase of 19.77%.
In 2024, the global semiconductor market is generally showing a trend of recovery. With the continuous recovery of the consumer electronics market and the accelerated landing of artificial intelligence (AI) applications, the industry will gradually emerge from the bottom range of the recession and usher in a new round of growth cycle. At the same time, with the rapid development of AI, high-performance computing and other fields, the requirements for chip performance and power consumption are constantly increasing. Through internal interconnect technology to achieve the chiplet and based on advanced packaging technologies and processes such as 2.5D/3D packaging technology to stack DRAM die vertically for high bandwidth memory (HBM), these will become the important direction of future development. The company's main products CMP equipment, thinning equipment are key core equipment for chip stacking technology and advanced packaging technology. They will have wider applications and are important opportunities for the company's future long-term high-speed development.
