Texas Instruments Inks Preliminary Agreement To Get Up To $1.6B In Chips And Science Act Proposed Funding For Semiconductor Manufacturing In Texas & Utah; Company To Get $6B-$8B From U.S. Department of Treasury's Investment Tax Credit
Texas Instruments Inks Preliminary Agreement To Get Up To $1.6B In Chips And Science Act Proposed Funding For Semiconductor Manufacturing In Texas & Utah; Company To Get $6B-$8B From U.S. Department of Treasury's Investment Tax Credit
德州儀器簽署初步協議，獲得高達16億美元的芯片和半導體制造科學法案提議的資金，該公司將從美國財政部的投資稅收抵免中獲得60億至80億美元。
- The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.
- TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments.
- The company also expects to receive $10 million in proposed funding for workforce development, as it creates over 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.
- 美國商務部提出通過CHIPS和Science法案，向TI直接提供高達16億美元的資金，以支持在德克薩斯州和猶他州正在施工的三個300毫米半導體晶圓廠。
- TI希望從美國財政部的投資稅收抵免計劃中獲得大約60億至80億美元的資金，以資助符合要求的美國製造業投資。
- 該公司還預計將獲得1000萬美元的提議資金用於職業發展，因其將創造超過2000個新的TI就業機會和成千上萬個施工、供應商和支持產業的間接就業機會。