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精智达(688627.SH):正在积极布局可以适用于采用先进封装技术的半导体存储器产品的测试设备

Jingzhida (688627.SH): is actively laying out the test equipment for semiconductor memory products that can be used in advanced packaging technology.

Gelonghui Finance ·  Sep 6 05:13

Jingzhida (688627.SH) stated on the interactive platform on September 6th that hybrid bonding is an advanced semiconductor packaging technology. The company is currently actively deploying testing equipment for semiconductor memory products that can be used with advanced packaging technology.

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