Mobilint Debut New AI Chips at Silicon Valley Summit
Mobilint Debut New AI Chips at Silicon Valley Summit
SEOUL, South Korea, Sept. 9, 2024 /PRNewswire/ -- Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.
韓國首爾，2024年9月9日 /PRNewswire/ — 由首席執行官申東珠領導的邊緣人工智能芯片公司Mobilint將在即將在硅谷舉行的2024年人工智能硬件與邊緣人工智能峯會上大放異彩。爲期三天的活動將於9月10日開始，將展示Mobilint在人工智能芯片技術方面的最新創新。該公司將現場演示其用於設備端人工智能的高效 SoC 「REGULUS」 和用於本地人工智能的高性能加速芯片 「ARIES」。
The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.
人工智能硬件峯會是一年一度的盛會，微軟、英偉達、谷歌、Meta和AMD等全球IT巨頭以及知名初創公司齊聚一堂，分享他們在人工智能和機器學習方面的發展。今年的峯會邀請了世界知名的人工智能專家作爲演講嘉賓，包括Landing AI首席執行官安德魯·吳和微軟Azure首席技術官馬克·魯西諾維奇。
Mobilint has secured one of only seven exclusive workshop sessions at the event, joining the ranks of industry leaders such as AMD, Intel, Qualcomm, and SambaNova. The company plans to introduce two of its AI chips. Notably, REGULUS will be unveiled for the first time in the global market at this event. The Mobilint workshop session is receiving an enthusiastic response, to the point that reservations have already closed.
Mobilint在活動中獲得了僅有的七場獨家研討會中的一場，加入了AMD、英特爾、高通和SambaNova等行業領導者的行列。該公司計劃推出兩款人工智能芯片。值得注意的是，REGULUS將在本次活動中首次在全球市場上亮相。Mobilint研討會獲得了熱烈的反響，以至於預訂已經截止。
REGULUS is a standalone AI SoC designed to deliver AI computing performance of over 10 TOPS while consuming less than 3W of power. It integrates high-performance CPU, codec, and ISP components, making it suitable for applications in robotics, drones, home appliances, dash cameras, and CCTV systems.
REGULUS 是一款獨立的人工智能 SoC，旨在提供超過 10 TOPS 的人工智能計算性能，同時消耗不到 3W 的功耗。它集成了高性能 CPU、編解碼器和 ISP 組件，使其適用於機器人、無人機、家用電器、行車記錄儀和閉路電視系統中的應用。
Additionally, Mobilint plans to debut a Software Development Kit (SDK) tutorial to the public during the workshop and aims to establish a platform later this year that allows developers to test products in a web environment.
此外，Mobilint計劃在研討會期間向公衆發佈軟件開發套件（SDK）教程，並計劃在今年晚些時候建立一個平台，允許開發人員在網絡環境中測試產品。
Mobilint shared that it will conduct the tape-out for its first product, ARIES, later this month. The mass production of ARIES is targeted for January next year, and pre-orders are currently open.
Mobilint表示，它將在本月晚些時候進行其首款產品ARIES的錄製。ARIES的批量生產定於明年1月，目前正在開放預訂。
CEO Dongjoo Shin said, "We aim to transparently showcase the actual performance, versatility, and usability of our AI semiconductors at this event, proving our technological competitiveness. We are committed to challenging the global market based on trust and mutual growth with our customers."
首席執行官申東珠說：「我們的目標是在本次活動中透明地展示我們的人工智能半導體的實際性能、多功能性和可用性，以證明我們的技術競爭力。我們致力於在與客戶的信任和共同增長的基礎上挑戰全球市場。」
SOURCE Mobilint, Inc.
來源 Mobilint, Inc.