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芯联集成(688469.SH):公司应用于AI服务器多相电源的BCD工艺产品,成功量产

Chipbond Integration (688469.SH): The company has successfully mass-produced BCD process products for AI server multi-phase power supply.

Gelonghui Finance ·  Sep 10 07:56

Gelonghui, September 10 | Xinlian Integration (688469.SH) said at an investor relations event that with the gradual completion of inventory removal by terminal manufacturers and superposition of large AI models to enable accelerated iterative upgrading of smartphones and PCs, consumer electronics demand picked up in the first half of 2024, and supply chain manufacturers are expected to continue their recovery trend in the second half of the year. The company mainly covers the AI mobile phone, AI computer and server markets in the field of AI artificial intelligence. In AI data center applications, the company and chip design partners have obtained a major focus on power management chips. The company's BCD process products used in AI server multi-phase power supplies were successfully mass-produced; the low-voltage high-current power management process platform covering AI server power chips realizes a higher density power management scheme through integrated DrMOS to meet high-current switches; the intelligent high-side switch platform is used for intelligent control and protection of automobile high-side switches, which combines control with power devices, and can provide better circuit protection and fault detection functions. With the technical layout and market development in the AI field, the company will continue to promote the application and market penetration of products such as intelligent sensor chips and high-efficiency power management chips in the fields of automotive intelligence and robotics. As a one-stop system foundry platform for integrated circuit manufacturing, the company's customer information is kept confidential according to customer requirements, so the company's customer information involves trade secrets and is not convenient to disclose.

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