Fujifilm Corporation (Headquarters: Minato-ku, Tokyo, President and CEO: Teiji Goto) will further expand its semiconductor material business by enhancing facilities for the development, production, and quality evaluation of advanced semiconductor materials at its development and production bases in Shizuoka and Oita. The total investment in facilities is approximately 20 billion yen.

With the high-speed and high-capacity communication of 5G/6G, the expansion of self-driving cars, the proliferation of AI and metaverse, the further growth and high performance of semiconductors are expected. In this context, it is increasingly important to globally supply higher quality and higher performance products of semiconductor materials used in semiconductor manufacturing processes.
Fujifilm develops and globally deploys a wide range of process materials from pre- to post-semiconductor manufacturing processes, such as photoresist, photolithography-related materials, CMP slurry, post-CMP cleaners, thin film formation materials, polyimides, color filter materials for image sensors, and Wave Control Mosaic, covering almost the entire range of semiconductor manufacturing processes. By leveraging a rich product lineup that covers from cutting-edge to non-cutting-edge areas, a global stable supply system with manufacturing bases in major countries in Japan, the USA, Europe, and Asia, and a high level of research and development capabilities, Fujifilm is committed to solving customer challenges with a one-stop solution. Additionally, the active facility investment in production sites both domestically and abroad is advancing the expansion of semiconductor material production capacity.

Fujifilm Electronics Materials Co., Ltd., the core company in the semiconductor material business, is strengthening its facilities for the development, production, and quality evaluation of advanced semiconductor materials at the two development and production bases in Shizuoka and Oita.
In the Shizuoka base, an investment of approximately 13 billion yen will be made to enhance the development, production, and quality evaluation capabilities of cutting-edge resists such as extreme ultraviolet (EUV) photoresists and Wave Control Mosaic. A new building will be constructed with a clean room and state-of-the-art inspection equipment. The investment in Oita, around 7 billion yen, will involve the construction of a new building on land adjacent to the existing factory. The production capacity at the Oita base will be expanded by about 40% by introducing production facilities and inspection equipment for post-CMP cleaners, a key material in the semiconductor manufacturing process used to uniformly flatten the semiconductor surface. It is expected that the market for post-CMP cleaners, which are materials used to wash particles, trace metals, and organic residues while protecting the metal surface after using a polishing agent CMP slurry, will grow by 9% annually. By achieving stable and swift supply of post-CMP cleaners through this facility enhancement, further business expansion is aimed. Leveraging the strengths that can be proposed in combination with CMP slurry, we will solve the challenges faced by customers, contribute to further enhancing the performance of semiconductors.
The start of operations for the new building in Shizuoka is scheduled for autumn 2025, and the start of operations for the new building in Oita is scheduled for spring 2026.

We will continue to accelerate the development of semiconductor materials covering a wide range from cutting-edge to non-cutting-edge semiconductors, and achieve further stable supply, contributing to the development of the semiconductor industry.

• * Wave Control Mosaic is a registered trademark or trademark of Fujifilm Corporation.
• *1 Materials applied onto wafers during the circuit pattern formation process in semiconductor manufacturing.
• Chemicals and cleaners used in the photoresist process of semiconductor manufacturing.
• Abrasive material used to uniformly flatten semiconductor surfaces with different hardnesses and mixtures of wiring and insulating films. CMP stands for Chemical Mechanical Polishing.
• Cleaner that washes off particles, trace metals, and organic residues while protecting the metal surface after polishing with CMP slurry.
• Materials used to form low dielectric constant insulation films.
• Material with high heat resistance and insulation properties used in forming protective films and rewiring layers of semiconductors.
• Functional materials that control a wide range of electromagnetic waves (light) wavelengths. It includes colored photosensitive materials used in the manufacturing of color filters for image sensors like CMOS sensors used in digital cameras and smartphones.
• From the 2023 edition of the Semiconductor Materials Report by the U.S. research company Linx Consulting.

1. Shizuoka Base

Kawashiri, Yoshida-cho, Haruno-gun, Shizuoka Prefecture (inside the FFEM Shizuoka factory)

Approximately 13 billion yen

Construction of a new building for enhancing the development, production, and quality evaluation functions of advanced photoresist and Wave Control Mosaic
(Including the installation of clean rooms and the introduction of inspection equipment)

Autumn of 2025

2. Oita Base

Oita City, Oita Prefecture, Oaza Shimogo Aza Chuushinchi

Approximately 7 billion yen

New building for increasing production capacity of post-CMP cleaners and enhancing quality evaluation functions (including introduction of production equipment and inspection devices)
(Including introduction of production equipment and inspection devices)

Spring 2026

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• *The contents of the article are as of the time of announcement. Please note that there may be changes to the latest information (such as discontinuation of production and sales, changes to specifications and prices, changes to organization and contact information).