Toronto, Ontario--(Newsfile Corp. - October 1, 2024) - FTG Corporation (TSX: FTG), a global aerospace and defence electronics company, is pleased to announce its participation at the upcoming Cantech Letter Investment Conference on Wednesday, October 9, 2024 in Toronto Ontario. Mr. Brad Bourne, President and CEO of FTG Corporation will be doing an investor presentation and participating in 1-on-1 meetings with investors at the conference.

2024 Cantech Letter Conference
Date: Wednesday, October 9, 2024
Location: Arcadian Loft, 8th floor, 401 Bay Street, Toronto, ON
Contact: tara@cantechletter.com to register
More info:

Mr. Brad Bourne, President and CEO of FTG Corporation commented, "We are delighted to be participating in the Cantech Letter Conference as it's an excellent platform to strengthen our connections within the capital markets. We hope to enhance our visibility, showcase our achievements, and increase our profile among the investor communities."

About Cantech Letter Conference

The Cantech Letter Conference, recognized as Canada's foremost technology investment event, provides up and coming technology companies with the unique opportunity to showcase their innovations and growth strategies, and participate in individual 1-on-1 meetings with potential investors and capital markets professionals. The conference serves as a hub for networking, knowledge exchange, and investment opportunities, while also featuring panel discussions with industry experts to offer insights into current trends, challenges, and opportunities within the technology sector.

About FTG Corporation

FTG has two operating units and is growing fast through organic growth initiatives and acquisitions. FTG Circuits is a manufacturer of high technology, high reliability printed circuit boards for the aerospace and defence markets. FTG Aerospace designs, manufactures and repairs cockpit panels, keyboards and assemblies for the aerospace and defence markets. FTG has nine operating sites located in the United States, Canada and China.