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大摩:三星HBM4技术将外包给台积电

TMTPost News ·  Oct 9 03:27

钛媒体App 10月9日消息,大摩半导体产业分析师詹家鸿指出,三星预计在2026年将其HBM4基底技术外包给台积电,并采用12nm/6nm制程。台积电面临强劲需求的情况下,正积极进行产能扩张,预计在2025年将资本支出增加至380亿美元。

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