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沃格光电(603773.SH):玻璃基封装载板产品主要应用于CPO光模块

wg tech (603773.SH): Glass-based encapsulation carrier board products are mainly used in CPO optical modules.

Gelonghui Finance ·  Oct 11 00:35

GrillUnicom on October 11th|wg tech (603773.SH) stated on the investor interaction platform that the company's glass-based encapsulation carrier plate products are mainly used in CPO optical modules, RF (mobile phones and 5.5G/6G communication base stations, etc.), GPU/HBM packaging, AI computing servers, etc., using chiplet multi-core chip integration, FOPLP board-level packaging and other packaging forms. Currently, it is cooperating with well-known domestic end customers to develop related products. Specific customer names and project details cannot be disclosed due to confidentiality requirements, thank you for your understanding.

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