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晶盛机电(300316.SZ):截至2023年12月31日,未完成晶体生长设备及智能化加工设备合同总计282.58亿元

zhejiang jingsheng mechanical & electrical (300316.SZ): As of December 31, 2023, the total amount of uncompleted contracts for crystal growth equipment and intelligent processing equipment amounted to 28.258 billion yuan.

Gelonghui Finance ·  Oct 15 04:29

On October 15, Jing Sheng Mechanical and Electrical (300316.SZ) stated on the investor interaction platform that as of December 31, 2023, the company had not completed a total of 28.258 billion yuan in contracts for crystal growth equipment and intelligent processing equipment, with 3.274 billion yuan incomplete for semiconductor equipment contracts. In the field of semiconductor equipment, the company is actively developing research and development of large silicon wafer manufacturing, chip manufacturing, packaging equipment, gradually achieving domestic breakthroughs in 8-12 inch semiconductor large silicon wafer equipment, achieving mass sales of related products, and receiving wide recognition from downstream customers, leading in domestic market share of domestically produced semiconductor long crystal equipment. The fully automatic single crystal silicon growth furnace product was selected for the national semiconductor device special equipment field enterprise standard "Leader" list, and the company's single-piece silicon epitaxial growth equipment won the 15th China Semiconductor Equipment Innovation Product. Based on the extension of the industry chain, the company has developed 6-8 inch silicon carbide long crystal equipment, slicing equipment, thinning equipment, polishing equipment, and epitaxial equipment in the power semiconductor field, 8-12 inch atmospheric silicon epitaxial equipment, achieving domestic substitution of silicon carbide epitaxial equipment, and innovatively launching double-piece silicon carbide epitaxial equipment, significantly increasing epitaxial capacity; in the advanced process field, 8-12 inch reduced pressure silicon epitaxial equipment, LPCVD, ALD equipment have been developed, and a variety of applications for advanced packaging of 12-inch wafers thinning equipment. The company will rely on the industry trend and opportunities of domestic substitution of semiconductor equipment, continue to leverage the core advantages of the company's strong innovation capabilities, accelerate the layout of core equipment in the semiconductor industry chain, and seize the market for domestic substitution of semiconductor equipment.

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