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天承科技(688603.SH):公司3年内争取实现30%以上从先进封装到晶圆制造的电镀添加剂国内市场份额

Tiancheng Technology (688603.SH): The company aims to achieve a domestic market share of over 30% from advanced packaging to wafer manufacturing electroplating additives within the next 3 years.

Gelonghui Finance ·  Oct 17, 2024 16:01

The investor relations activity record of Tiancheng Technology (688603.SH) on October 17th showed that the company is committed to becoming the main supplier of major international and domestic mainstream packaging and testing customers in the next 2 years. The company aims to achieve a domestic market share of over 30% from advanced packaging to wafer manufacturing electroplating additives within 3 years.

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