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博众精工(688097.SH):共晶贴片机可以用于目前主流的400G、800G、1.6T光模块贴合场景

Bozhong Precision (688097.SH): Eutectic Soldering Machine can be used in the current mainstream 400G, 800G, 1.6T optical module bonding scenarios

Gelonghui Finance ·  Nov 5 16:16

Gelonghui November 5th | Bozhong Jinggong (688097.SH) stated on the investor interaction platform that its eutectic soldering machine can be used in the current mainstream 400G, 800G, and 1.6T optical module bonding scenarios. In 2023, the company launched a new product, Xingwei EH9721, which has already received bulk orders of 400G/800G from industry-leading companies, mainly focusing on the research and development of 800G optical module products with increased computing power requirements. Its core technologies, such as high-precision pick-and-place bonding systems, efficient eutectic heating systems, wafer feeding systems, etc., have reached the international advanced level, with significant competitive advantages.

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