据财联社主题库显示，相关上市公司中：The 21st China International Semiconductor Exhibition (ICChina2024) will be held at the Beijing National Convention Center from November 18th to November 20th. Yole predicts that the global advanced packaging market is expected to grow from $46.83 billion in 2023 to $78.55 billion in 2028.
The 21st China International Semiconductor Exhibition (ICChina2024) will be held at the Beijing National Convention Center from November 18th to November 20th. On November 19th, the focus will be on the Advanced Packaging Innovation Development Forum.
Shanxi Securities analyst Gao Yuyang pointed out that advanced packaging technology has a wide range of applications, covering multiple areas such as mobile devices, high-performance computing, and the Internet of Things. Modern smartphones extensively use CSP and 3D packaging technology to achieve high performance, low power consumption, and small size goals; in the high-performance computing field, 2.5D and 3D integration technology are widely used in the packaging of processors and memory, significantly improving computing performance and data transmission efficiency. Yole predicts that the global advanced packaging market is expected to grow from $46.83 billion in 2023 to $78.55 billion in 2028. Due to the rapid growth in demand for high-performance computing driven by AI, communication infrastructure is the fastest-growing sector in advanced packaging, with an expected 17% compound growth from 2022 to 2028.
According to the Financial Data Center, among related listed companies:
Wuxi Taiji Industry's subsidiary Taiji Semiconductor Packaging products are gradually optimized. In terms of packaging technology, closely aligned with application-side demands, advanced packaging such as FBGA, flip-chip BGA/FC, etc., have been developed on the basis of traditional packaging such as TSOP, QFP, BOC, BGA.
Changzhou Tronly New Electronic Materials develops and produces photosensitive polyimide, widely used as redistribution layer material in advanced packaging.
