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深南电路(002916.SZ):封装基板业务产品包括模组类封装基板、存储类封装基板、应用处理器芯片封装基板等

Shennan Circuits (002916.SZ): The product line of the packaging substrate business includes modular packaging substrates, memory packaging substrates, application processor chip packaging substrates, and others.

Gelonghui Finance ·  Nov 13 07:28

Gelonghui reported on November 13 that shennan circuits (002916.SZ) stated in investor relations that the company's packaging substrate business covers a wide variety of product types, including module packaging substrates, storage packaging substrates, and application processor chip packaging substrates, mainly used in mobile intelligent terminals, servers/storage, and other fields. In the third quarter of 2024, the downstream market demand for packaging substrates slowed down, and the company's packaging substrate product structure was adjusted in response to fluctuations in downstream market demand.

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