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华光新材(688379.SH):研发的导电胶、银铜钛焊膏等产品应用于半导体封装领域

Hangzhou Huaguang Advanced Welding Materials (688379.SH): The developed conductive adhesive, silver-copper-titanium solder paste, and other products are applied in the field of semiconductor packaging.

Gelonghui Finance ·  Nov 19 02:39

Gelonghui, November 19丨Huaguang New Materials (688379.SH) said on the investor interactive platform that currently the conductive adhesive, silver-copper-titanium solder paste and other products developed by the company are used in the semiconductor packaging field. Among them, conductive adhesive products have passed the first tests of two customers. Silver-copper-titanium solder paste products are mainly used in IGBT's AMB ceramic substrates, and the company is currently advancing research and development.

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