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联瑞新材(688300.SH):公司产品可以应用于AI芯片封装材料中

Novoray Corporation (688300.SH): The company's products can be used in ai chip packaging materials.

Gelonghui Finance ·  Nov 27 16:05

On November 27, Ge Long Hui reported that Novoray Corporation (688300.SH) stated on the interactive platform that the current mainstream packaging technologies globally are primarily CSP and BGA, while chips in the AI field need to possess high-performance computing capabilities, often utilizing advanced packaging forms that are high-performance and high-density, such as system-in-package (SIP), 3D packaging, and fan-out wafer-level packaging (FOWLP). These technologies place greater demands on packaging processes and materials. For packaging fillers, in addition to possessing ultra-fine particle sizes, low CUT points, and high thermal conductivity, they must also have high purity and safety, among other characteristics. The company's products can be applied in AI chip packaging materials and maintain good cooperative relationships with downstream customers. Specific unpublished business details cannot be disclosed due to confidentiality agreements.

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