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芯联集成(688469.SH):激光雷达核心芯片VCSEL以及微振镜芯片进入规模量产

Xinlian Integrated (688469.SH): The core chip VCSEL of lidar and micro scanning mirror chip have entered mass production.

Gelonghui Finance ·  Nov 27 17:45

On November 27, Gelonghui reported that Xinian Integration (688469.SH) stated on the interactive platform that the company's products mainly include core chips and modules for power control, power drive, and sensor signal chains applied in automotive, industrial control, and high-end consumer fields, providing complete system OEM solutions for autos, new energy fund, industrial control, and home appliances. The company adheres to a high level of investment in technology research and development, continuously introduces high-end technical talents, and is equipped with internationally advanced technical resources. It vigorously develops wafer manufacturing processes and extends into module packaging to promote integration development in the chip industry, successfully launching new products and securing multiple significant client partnerships. (1) In automotive electronics: In terms of electrification, power semiconductors, especially advanced SiC chips and modules, have entered large-scale production; onboard analog ICs have launched multiple domestically leading and globally advanced technological platforms, filling the gap of high-voltage, high-power digital-analog hybrid signal integrated ICs in the domestic market. In terms of intelligence, lidar core chips VCSEL and micro-mirror chips have reached large-scale production; multiple sensor projects, including high-precision inertial navigation sensors, pressure sensors, and high-performance onboard microphones, have been integrated into smart automobile terminals, comprehensively assisting the development of automotive intelligence. (2) In industrial control: AI servers, datacenter, and other application directions: a 55-nanometer high-efficiency power management chip platform technology for datacenter servers has been released and major project validation has been obtained. In wind-solar storage and charging: high-power, high-reliability, and high-stability power semiconductors IGBT and SiC chips and modules have been provided for leading global companies. In smart grid direction: core devices for ultra high pressure direct current transmission, ultra high pressure IGBT products, have achieved mass production. (3) In consumer electronics: In mobile phones and wearable applications: the company's sensors and battery management protection products have already occupied a leading position in the market and technology, launching a high-performance microphone platform; at the same time, low-voltage 40V BCD and digital-analog hybrid technology platforms for consumer applications have been launched, achieving mass production. In home appliance application areas, a full range of smart power module products have been launched, achieving breakthroughs with multiple major clients and entering mass production.

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