Rapidus Collaborates With Cadence on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Rapidus Collaborates With Cadence on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Rapidus and Cadence are working to develop an AI-driven digital and analog/mixed-signal reference design flow that includes Cadence design solutions. Customers will be able to use Cadence's broad portfolio of interface and memory IP components, including HBM4, 224G SerDes, PCI Express 7.0 and more, while also taking advantage of 2nm GAA and BSPDN design and manufacturing solutions that support Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept.Collaboration spans interface and memory IP utilizing 2nm gate-all-around, BSPDN technology and AI-driven reference flows to facilitate the development of advanced, energy-efficient chips
协作跨越接口和内存知识产权，利用2纳米全栅极技术、BSPDN技术和人工智能驱动的参考流程，以促进先进、节能芯片的开发
TOKYO, Dec. 10, 2024 /PRNewswire/ -- SEMICON Japan Booth #2148 -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced a collaboration with Cadence Design Systems, Inc. to provide co-optimized AI-driven reference design flows and a broad IP portfolio. The new collaboration will support the Rapidus 2nm gate-all-around (GAA) process and leverage the design and manufacturing benefits from its backside power delivery network (BSPDN) technology to provide design solutions and IP portfolio to customers.
东京，2024年12月10日 / 美通社 / -- SEMICON日本展位#2148 -- Rapidus公司，一家先进逻辑半导体制造商，今天宣布与铿腾电子公司合作，提供共同优化的人工智能驱动参考设计流程和广泛的知识产权组合。新的合作将支持Rapidus的2纳米全栅极（GAA）工艺，并利用其背部电源分配网络（BSPDN）技术的设计和制造优势，为客户提供设计解决方案和知识产权组合。
As the semiconductor industry struggles to keep up with significantly increasing design challenges driven by the need for more computation, GAA and BSPDN manufacturing technologies are becoming vital to meet increasingly stringent power, performance and area requirements.
随着半导体行业在满足不断增加的计算需求所带来的设计挑战上苦苦挣扎，GAA和BSPDN制造技术正在变得至关重要，以满足日益严格的功率、性能和面积要求。
Rapidus and Cadence are working to develop an AI-driven digital and analog/mixed-signal reference design flow that includes Cadence design solutions. Customers will be able to use Cadence's broad portfolio of interface and memory IP components, including HBM4, 224G SerDes, PCI Express 7.0 and more, while also taking advantage of 2nm GAA and BSPDN design and manufacturing solutions that support Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept.
Rapidus和Cadence正在合作开发一个人工智能驱动的数字和模拟/混合信号参考设计流程，其中包括Cadence的设计解决方案。客户将能够使用Cadence广泛的接口和内存知识产权元件组合，包括HBM4、224G SerDes、PCI Express 7.0等，同时也将受益于2纳米GAA和BSPDN设计及制造解决方案，这些方案支持Rapidus的制造设计与共同优化（DMCO）概念。
"Our broad collaboration with Rapidus for 2nm GAA BSPDN technology leverages Cadence's AI-driven solutions to solve real-world problems and meet customer needs," said Dr. Anirudh Devgan, president and CEO at Cadence. "By bringing together Cadence's advanced interface and memory IP technology, reference flows and Rapidus' process technology, we're empowering the buildout of the AI infrastructure of tomorrow."
"我们与Rapidus在2纳米GAA BSPDN技术上的广泛合作利用了Cadence的人工智能驱动解决方案，解决现实世界问题并满足客户需求，" Cadence总裁兼首席执行官安尼鲁德·德夫甘博士表示。"通过将Cadence的先进接口和内存知识产权技术、参考流程与Rapidus的工艺技术结合起来，我们正在使明天的人工智能基础设施得以构建。"
"Our collaboration with Cadence on 2nm BSPDN technology puts us at the industry's forefront, marking a major leap in semiconductor innovation for performance and efficiency. By combining our expertise, we're excited to set new technology standards and create transformative solutions for our mutual customers and the industry," said Dr. Atsuyoshi Koike, CEO of Rapidus.
"我们与Cadence在2纳米BSPDN技术上的合作使我们站在行业最前沿，标志着半导体创新在性能和效率上的重大飞跃。通过结合我们的专业知识，我们很高兴设定新的技术标准，并为我们的共同客户和行业创造变革性解决方案，" Rapidus首席执行官小池篤义博士表示。
About Rapidus Corporation
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging, and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people's lives through the use of semiconductors.
关于Rapidus公司
Rapidus公司旨在开发和制造世界上最先进的逻辑半导体。我们将通过开发和提供服务来缩短设计、晶圆工艺、3D封装等周期时间，与客户一起创造新产业。我们将继续挑战自我，以通过使用半导体来贡献人们生活的满足、繁荣和幸福。
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About Rapidus Corporation | |
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Headquarters: |
4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0032, Japan |
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Establishment: |
August 10th, 2022 |
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Executives: |
Tetsuro Higashi, Chairman of the Board of Directors |
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Business: |
Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components |
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Capital, etc: |
7,346 million yen (as of November 2022) |
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关于Rapidus公司 | |
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总部： |
日本东京千代田区小冢町4-1，邮政编码102-0032 |
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成立： |
2022年8月10日 |
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高管： |
东村哲郎，董事会主席 |
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业务: |
半导体器件、特斯拉-集成电路及其他电子元器件的研发、设计、制造和销售 |
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资本，以太经典： |
734600万日元（截至2022年11月） |
U.S. Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
美国媒体联系人：
Devan Gillick – Breakaway Communications 为 Rapidus
电子邮件: [email protected]
手机: (530) 591-3194
SOURCE Rapidus Corporation
来源: Rapidus Corporation
