据悉，本次发行募集资金投资项目包括：功率半导体模块散热基板智能制造及产能提升项目、研发中心建设项目、补充流动资金。合计拟投入募集资金5.02亿元。Huangshan Gujie (301581.SZ) disclosed its prospectus, and the company plans to issue 20 million shares of Stocks for the first time.
According to Smart Finance APP, Huangshan Gujie (301581.SZ) disclosed its prospectus, and the company plans to issue 20 million shares of Stocks for the first time, with an issue price of 27.50 yuan per share, and the subscription date is December 23, 2024.
The announcement shows that Huangshan Gujie is a national high-tech enterprise specialized in the research, production, and sales of power Semiconductors module heat dissipation substrates, and is a leading company in the automotive grade power Semiconductors module heat dissipation substrate Industry. The company’s products are primarily used in the New energy Fund field, being an important component of power Semiconductors modules for Electric Machine controllers in New energy Fund vehicles. Meanwhile, the company’s products also have broad application prospects in areas such as New energy generation and energy storage. The main products include Copper pin heat dissipation substrates and Copper flat-bottom heat dissipation substrates, both of which are used in the heat dissipation systems of power Semiconductors modules, with Copper pin heat dissipation substrates used in the New energy Fund vehicle sector, and Copper flat-bottom heat dissipation substrates applied in New energy generation and other fields. From the fiscal year 2021 to 2023, the Net income attributable to the parent company’s owners was 34.2786 million yuan, 99.4719 million yuan, and 0.157 billion yuan.
It is reported that the funds raised from this issuance will be invested in projects including: Intelligent Manufacturing and capacity enhancement projects for power Semiconductors module heat dissipation substrates, research and development center construction projects, and supplementing working capital. A total of 0.502 billion yuan is planned to be invested.
