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兴森科技(002436.SZ):公司目前具备20层及以下产品的量产能力,20层以上产品处于开发之中

Shenzhen Fastprint Circuit Tech (002436.SZ): The company currently has mass production capabilities for products with 20 layers and below, while products with more than 20 layers are under development.

Gelonghui Finance ·  Dec 24 03:19

According to Ge Long Hui on December 24, Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's FCBGA packaging substrates can be used for the packaging of high-end chips such as CPUs, GPUs, FPGAs, and ASICs. The company currently has the mass production capacity for products with 20 layers or fewer, while products with more than 20 layers are under development.

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