报告期内，公司自产产品主要包括SOC、BARC、KrF光刻胶、i-Line光刻胶等光刻材料以及TEOS等前驱体材料，主要应用于先进NAND、DRAM存储芯片与90nm技术节点及以下逻辑芯片生产制造的光刻、薄膜沉积等工艺环节。此外，在境内集成电路产业替代需求增加的背景下，为快速获取客户资源，并积累产品导入和品控经验，公司以引进境外产品为切入点，引进并销售光刻材料、前驱体材料、电子特气及其他湿电子化学品等集成电路关键材料，创新性地走出了一条“引进、消化、吸收、再创新”的发展路径。On December 26, Xiamen Hengkang New Materials Technology Co., Ltd.'s IPO application to the Shanghai Stock Exchange Star has been accepted. China Securities Co., Ltd. is its sponsoring institution, aiming to raise 12 billion yuan.
According to Zhitong Finance APP, on December 26, Xiamen Hengkang New Materials Technology Co., Ltd. (referred to as: Hengkang New Materials) has had its IPO application accepted on the Star market. China Securities Co., Ltd. is its sponsor, aiming to raise 1.2 billion yuan.
The prospectus shows that Hengkang New Materials is committed to the research and industrial application of key materials in the integrated circuit field, being one of the few innovative enterprises domestically capable of developing and mass-producing key materials for 12-inch integrated circuit wafer manufacturing, mainly engaged in the R&D, production, and sales of photoresist materials and precursor materials.
During the reporting period, the company's self-produced products mainly included SOC, BARC, KrF photoresist, and i-Line photoresist, as well as precursor materials like TEOS, primarily applied in the photolithography and thin-film deposition processes for advanced NAND, DRAM storage chips, and manufacturing of logic chips at 90nm technology nodes and below. In addition, amidst the increasing domestic demand for integrated circuit industry substitution, to quickly acquire customer resources and accumulate product introduction and quality control experience, the company has innovatively taken the approach of 'introducing, digesting, absorbing, and re-innovating' by importing and selling critical integrated circuit materials such as photoresist materials, precursor materials, electronic specialty gases, and other wet electronic Chemicals.
For example, based on the company's self-produced photoresist materials, according to Frost & Sullivan market research, in the 12-inch integrated circuit field, the domestic production rate of i-Line photoresist and SOC is around 10%, while the domestic production rate of BARC and KrF photoresist is about 1-2%, and the production rate of ArF photoresist is less than 1%. In the future, domestic key materials enterprises will continue to focus on domestic application as their main breakthrough direction. The company is among the few to achieve mass production and supply of photoresist and precursor materials, and according to Frost & Sullivan market research, in 2023, the sales scale of SOC and BARC ranked first among domestic manufacturers in the market.
In terms of finance, during the years 2021, 2022, 2023, and the first half of 2024, Hengkang New Materials achieved revenues of approximately 0.141 billion yuan, 0.322 billion yuan, 0.368 billion yuan, and 0.238 billion yuan respectively; during the same period, the net income was approximately 26.5642 million yuan, 99.7283 million yuan, 89.7626 million yuan, and 44.0992 million yuan.
