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NXP, and Foxconn Industrial Internet Ltd. Announced Strategic Partnership to Accelerate Automotive Innovation

NXP, and Foxconn Industrial Internet Ltd. Announced Strategic Partnership to Accelerate Automotive Innovation

恩智浦和富士康工業互聯網有限公司宣佈建立戰略合作伙伴關係加速汽車創新
Benzinga Real-time News ·  2021/12/16 05:56

NXP Semiconductors N.V. (NASDAQ:NXPI), a leading automotive semiconductor company, has announced a strategic partnership with Foxconn Industrial Internet Ltd., a subsidy company of Foxconn group, (FII;601138.SH) to transform the car into the ultimate edge device. NXP will provide FII with its comprehensive portfolio of automotive technologies. The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable leading global automotive OEMs and Tier Ones to deliver vivid in-vehicle experiences for their customers. The digital cockpit solution is expected to start mass production in 2023. The companies aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP's leading radar solutions. "FII is committed to providing clients with an automated, connected platform and big data-based technology, services and solutions, in order to create application platforms across cloud computing, mobile devices, Internet of Things (IoT), artificial intelligence (AI), smart networks, robotics and automation, among other industries," said Brand Cheng, CEO at Foxconn Industrial Internet Co. Ltd. "We believe that EVs and emerging technology innovation are derived from computing power, system integration, and energy management. We are pleased to join forces with NXP to strengthen the development blueprint of FII and drive innovation for connected cars by leveraging NXP's leading automotive technology." "As a leading global automotive semiconductor supplier, NXP has combined its strong heritage in safety, security and quality with innovation across the vehicle's domains," said Ron Martino, Executive Vice President and General Manager of Edge Processing for NXP Semiconductors. "We are excited to extend the benefits of our i.MX 8 series processors for a full digital cockpit solution.to FII, a leading technology services provider, and look forward to a long-term strategic partnership, which will provide system-level solutions for the realization of next-generation automotive innovation."

領先的汽車半導體公司恩智浦半導體(納斯達克:NXPI)宣佈與富士康集團的補貼公司富士康工業互聯網有限公司(FII;601138.SH)建立戰略合作伙伴關係,將這款車轉變為終極邊緣設備。恩智浦將向FII提供其全面的汽車技術組合。聯合項目的第一階段將專注於開發基於恩智浦i.MX 8 QuadMax的全數字駕駛艙解決方案。該平臺將包括數字集羣和平視顯示器(HUD)系統,這將使領先的全球汽車OEM和Tier One能夠為他們的客户提供生動的車載體驗。數字駕駛艙解決方案預計將於2023年開始批量生產。兩家公司的目標是通過恩智浦領先的雷達解決方案,將合作關係擴展到基於UWB的安全汽車接入和安全自動駕駛領域。富士康工業互聯網有限公司首席執行官Brand Cheng表示:“FII致力於為客户提供自動化、互聯平臺和基於大數據的技術、服務和解決方案,以創建跨越雲計算、移動設備、物聯網(IoT)、人工智能(AI)、智能網絡、機器人和自動化等行業的應用平臺。”我們相信電動汽車和新興技術創新源於計算能力、系統集成和能源管理。我們很高興與恩智浦聯手,加強FII的發展藍圖,並通過利用恩智浦領先的汽車技術來推動聯網汽車的創新。羅恩·馬蒂諾説:“作為全球領先的汽車半導體供應商,恩智浦將其在安全、安保和質量方面的強大傳統與汽車領域的創新結合在一起。”, 恩智浦半導體執行副總裁兼邊緣加工部總經理。我們很高興能將我們i.MX 8系列處理器的好處擴展到領先的技術服務提供商FII公司,提供全數字駕駛艙解決方案,並期待着建立長期的戰略合作伙伴關係,這將為實現下一代汽車創新提供系統級的解決方案。“

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