FWP 1 ea189640-fwp_ccsctech.htm FREE WRITING PROSPECTUS

發行人免費書面意向書 2023年12月6日

根據1933年修正的《證券法》第433條規定提交

關於2023年11月30日的初步招股說明書

註冊聲明書編號333-270741

發行人自由書面招股說明書日期爲2023年12月[ ● ]，根據1933年證券法第433條修正案規定進行文件提交，與2023年11月30日初步招股說明書相關的註冊聲明編號333 - 270741投資者演示CCSC科技國際控股有限公司

本免費撰寫招股說明書與CCSC Technology International Holdings Limited（「我們」、「我們」或「我們的」）擬議的普通股（「普通股」）公開發行有關，應與我們向證券交易委員會（「SEC」）提交的與本演示相關的發行註冊聲明一起閱讀，可通過以下網址訪問：https://www.sec.gov/Archives/edgar/data/1931717/000121390023091161/ff12023a3_ccsctechnology.htm 該註冊聲明尚未生效。在投資前，您應閱讀註冊聲明中的招股說明書（包括其中描述的風險因素）以及我們向SEC提交的其他文件，以獲取有關我們和本次發行的更全面信息。您可以免費訪問SEC網站上的EDGAR獲取這些文件，網址爲http://www.sec.gov。或者，我們或我們的承銷商將安排發送給您招股說明書，如果您聯繫Revere Securities LLC的電子郵件地址：contact@reveresecurities.com，或通過電子郵件聯繫CCSC Technology International Holdings Limited：ir@ccsc-interconnect.com。

本招股說明書包含了關於我們當前期望和對未來事件的看法的前瞻性陳述，這些主要包含在「招股說明書摘要」、「風險因素」、「募集資金用途」、「管理對財務狀況和經營業績的討論與分析」、「行業概況」和「業務」等章節中。這些前瞻性陳述涉及涉及已知風險、不確定性和可能導致我們的實際結果、業績或成果與這些陳述所表達或暗示的大相徑庭的其他因素的事件。您可以通過諸如「可能」、「將」、「可能」、「期望」、「預測」、「目標」、「估計」、「打算」、「計劃」、「相信」、「很可能」，「提議」，「潛力」，「繼續」或其他類似表述的詞或短語來識別一些這些前瞻性陳述。我們在很大程度上基於我們對未來事件和我們認爲可能影響我們的財務狀況、經營業績、業務策略和資金需求的未來事件和財務趨勢的看法和預測，制定了這些前瞻性陳述。本招股說明書中包含的前瞻性陳述涉及，但不限於：我們的目標和策略；我們的業務和運營策略以及現有和新業務發展計劃、實施這些策略和計劃的能力和預期時間；我們未來業務發展、財務狀況和經營業績；我們預期的營收、成本或支出變化；我們的股息政策；我們對產品和服務需求及市場接受情況的期望；我們對客戶、業務合作伙伴和第三方之間關係的期望；中國和全球互聯產品行業的趨勢、預期增長和市場規模；我們能夠維護和加強市場地位的能力；我們繼續開發新技術和/或升級現有技術的能力；我們業務運營受到的法律、法規、政府政策、激勵措施和稅收的發展和變化；與我們業務和行業相關的相關政府政策和法規；我們行業中的競爭環境、競爭格局和潛在競爭者行爲；我們行業整體前景；我們吸引、培訓和留住高管和其他員工的能力；我們從這次發行中擬使用的募集資金；全球金融和資本市場的發展；通貨膨脹、利率和匯率波動；中國和我們開展業務的境外市場的總體商業、政治、社會和經濟狀況；COVID-19大流行對我們業務和行業的未來發展的影響；以及涉及或與前述任何事項有關的假設。這些前瞻性陳述涉及各種風險和不確定性。儘管我們認爲我們在這些前瞻性陳述中表達的期望是合理的，但我們的期望和實際結果可能與我們的期望有很大差異。此外，我們在不斷髮展的環境中運營。新的風險因素和不確定性時不時出現，我們的管理人員無法預測所有風險因素和不確定性，也無法評估所有因素對我們業務的影響，或任何因素或組合因素可能導致實際結果與任何前瞻性陳述所載內容有實質性不同的程度。您應該仔細閱讀本招股說明書以及我們所引用的文件，了解我們的實際未來結果可能會與我們期望的截然不同且可能更糟。我們通過這些警示性陳述對我們所有的前瞻性陳述做出約束。本招股說明書包含了來自政府和私人出版物的信息。這些出版物包括前瞻性陳述，可能存在風險、不確定性和假設。儘管我們認爲數據和信息可靠，但我們未獨立驗證這些出版物中數據和信息的準確性或完整性。這些出版物中的統計數據還包括基於若干假設的預測。互聯產品行業可能不會按照市場數據預測的速度增長，甚至根本不會增長。這些市場未按照預測速度增長可能對我們的業務和普通股市場價格產生重大負面影響。此外，互聯產品行業快速發展的性質導致對市場增長前景或未來狀況的任何預測或估算存在重大不確定性。此外，如果支撐市場數據的任何假設後來被發現是錯誤的，實際結果可能與基於這些假設的預測有所不同。參見「風險因素 — 與我們業務相關的風險」。您不應將前瞻性陳述視爲對未來事件的預測。本招股說明書中的前瞻性陳述基於本招股說明書日期以前的事件和信息制定。除法律規定外，我們不承擔更新或公開修訂任何前瞻性陳述的義務，無論是因爲新信息、未來事件或其他情況，自該陳述發佈之日起，或反映出乎意料的事件。您應該仔細閱讀本招股說明書以及我們在本招股說明書中引用並作爲註冊聲明附件提交的文件，充分理解我們的實際未來結果或表現可能與我們的預期有實質性差異。

CCSC Technology International Holdings Limited Issuer Ordinary Shares Securities Initial Public Offering Offering Type Nasdaq Capital Market: CCTG Proposed Listing/Symbol 1,250,000 Ordinary Shares, or 1,437,500 Ordinary Shares if the underwriter exercises its over - allotment option in full Ordinary Shares Offered $ 4.00 to $ 6.00 per Ordinary Share Offering Price $ 3.91 million (based upon an assumed initial public offering price of $5.00 per Ordinary Share, which is the midpoint of the estimated initial public offering price range) (or $ 4.77 million if the underwriter exercises its over - allotment option in full) Net Proceeds • Approximately 30% for upgrading facility and management system (including IT system) to enhance operational efficiency and increase production capacity; • Approximately 30% for marketing efforts and expand sales team; • Approximately 12% for research and development, including recruitment and cultivating of engineering talents; • Approximately 18% for strategic acquisitions and collaborations; • Approximately 10% for fund working capital and for other general corporate purposes. Use of Proceeds Revere Securities LLC Underwriter See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 4

CCSC Investment Limited (BVI) 2021 Public Investors Existing Minority Shareholders Sky Interconnect Global Limited (BVI) 2021 CCSC Technology International Holdings Limited (Cayman islands) 2021 CCSC Group Limited (BVI) 2021 CCSC Technology Group Limited (Hong Kong) 1993 Dongguan CCSC Interconnect Electronic Technology Limited (PRC) 1993 CCSC Interconnect Technology Europe B.V. (Netherlands) 2016 CCSC Interconnect Technology Limited (Hong Kong) 2020 Pre - IPO%/Post - IPO% 84.06%/74.72% 5.66%/5.03% 0%/11.11% 10.28%/9.14% 100% 100% 100% 100% 100% 100% See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 5

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 25 Countries Customer Base Throughout Asia, Europe, and the Americas OEM and ODM Interconnect Products For Manufacturing Companies that Produce End Products and Electronic Manufacturing Services (“EMS”) Close Relationships With Our Customers in Developing Products and Providing Solutions Strong R&D Capabilities Experienced Mechanical and Electrical Engineers Quality Products At Competitive Prices through a Vertically Integrated Production Process 68 Patents Registered with the PRC Intellectual Property Agency 6

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Experienced Management Team and Dedicated Workforce Strong Focus on Customers’ Needs and Value - added Services High Standard and Commitment to Quality Control Established Long - term Relationships with Customers and Key Suppliers Vertically Integrated Production 7

Description End Application/Products Industry Type of Connector Connect signals between two printed circuit boards (“PCB”) without a cable Personal Computer and Server, Telecom Switches, Video Conference Equipment; Networking Equipment (Modem, Router, Switch, Network Attached Storage) Computer, Network and Communication, Consumer Appliances, Medical Board to Board Connect wires to a printed circuit board (“PCB”) Power Supply, Electric Actuator for Hospital Bed, Computer Mainboard, Lighting Equipment for Architecture Lighting and Concert Lighting, Washing Machine, Coffee Machine, Television Industrial, Medical Equipment, Consumer Appliances Wire to Board Connect devices to power sources Robot Arm, Industrial Freezer for Truck, Lighting Equipment for Architecture Lighting and Concert Lighting, Industrial Equipment Power Supply, Automotive Audio, Car Seat Heating, Car Headlight Robotic, Industrial, Automotive Power Connect external devices, such as printers, keyboards, and displays to servers Computer Equipment and Peripheral Set Top Box, Robotic Arms, Smart Devices and Modules Industrial, Consumer Appliance Input Output See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 8

Technical Requirements/Specification End Application Industry Type of Cable and Wire Harness Waterproof capability meeting the requirement of the IPX7 industrial standard, which certifies that cables and wire harnesses can be submerged under up to one meter of water for 30 minutes and allows the end products to work safely and properly under harsh environmental conditions (i.e. typhoon with heavy raining) Compressor in Refrigerate Container, Industrial Freezer, Outdoor Lighting Cable Industrial Waterproof Cable Complex wire harness & assembly with more than 30 different kinds of electric wires bundled together up to 1,000 contact points Lighting Equipment (Architecture Lighting, Concert Lighting, etc.), Industrial Catering Oven, Coffee Machine Industrial, Consumer Appliance Complex Cable and Wire Harness with PCBA Medical grade materials specifically designed and engineered for medical use that have passed our stringent in house testing procedures to ensure long life cycle Dental X - ray Scanner, Disinfectant Cabinet Medical Equipment Medical Cable and Wire Harness To meet high transmission rate up to 10 Gigabit Ethernet standard with low latency time in order to let our customer product transfer and receive picture, voice, data signal in fast speed and high accuracy Computer Server, Switch, Router Network and Communication Network Cable High AC voltage (600V, 1000V and 2000V), and high flexibility (our cables and wire harnesses can achieve the bending test at180 degree for 10,000 times or more Robotic Arm Robotic Robotic Cable and Wire Harness See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 9

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. ISO 9001 ISO 14001 ISO 45001 ISO 13485 IATF 16949 Stringent Standards: Quality Control Technical Managerial Capabilities o f our Subcontractors Vertically - Integrated Manufacturing Process: Manufacturing Processes: • Molding • Wire C utting • Stripping/Crimping/Termination • Assembly (including surface mounting) • Soldering Initial Design Stage Final Production 10

Request for Customized Products Product Development Proposal • Performing Feasibility Studies with Budgetary Proposals for New Projects; • Creating Functional and Structural Design Concepts based on Specifications and Technical Requirements of Customers; • Preparing Proposals and Related Presentations to be Reviewed and Approved by Customers; • Verifying Design Concepts and Creating Prototypes, and Refining Prototypes if Required; • Defining Project Milestones and Overseeing Implementation of Each Project; • Performing Engineering Validation Tests, Design Validation Tests, and Production Validation Tests prior to Final Production. Start Our Design a nd Development Process : • Tooling • Sampling • Testing Process Initial Concept or Blueprint Provided by Our Customer Product Development Proposal Accepted by Customer Start Design and Development Process Detailed Responsibilities by Engineering Team 1 - 2 Months See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 11

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. • Single Wire • Cable • Insulation Tube • Standard Connector • Plastic Fabricated Part Cable and Plastics • Metal Shell • Metal Terminal • Metal Fabricated Part Metal Parts • Printed Circuit Board, • LED • Resistor • Capacitor • Transistor • Inductor • Thermistor • Potentiometer • Ferrite Core • Switch and Semiconductor Electronic Parts Sourced from Suppliers Located in the PRC, Hong Kong, Taiwan, and Europe Selection Criteria Quality Production Site Production Process Delivery Cycle Price Enterprise Resource Planning (“ERP”) System Monitors & Controls Stock Level of Components Based on Customer Purchase Orders and Customer Forecasts for t he Future Orders 12

• An Electromechanical Device Used to Join Electrical Conductors and Create an Electrical Circuit. • Bridges the C ommunication between Blocked or Isolated Electrical Circuits so that the Current Flows and the Electrical C ircuit may Achieve its Intended Function. • Devices Used to Transmit Electric or Magnetic Energy, Exchange Information, Generate Electromagnetic Energy Conversion, and Form Automated Control Route. Interconnect Products Connector Cable and Wire Harnesses Industries Applied • Automobiles • Telecommunications • Electronic Products • Industrial Manufacturing • Healthcare • Aerospace and Defense See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Source : Frost & Sullivan 14

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Final Products by Industry Computer Telecommunications Automotive Industrial Consumer Electronics Medical Lighting Robotics Upstream Raw Material Metal Material Phosphor Bronze, Brass, Titanium Cooper, SPCC Construction Material Copper - zinc Alloy, Ceramics, Glass, Abduct Material Electroplating Material Gold - plating, Silver - plating, Tin Lead Plating, Palladium Plating Plastic Material LCP, PPS, PCT, PBT, NLCON, PC Midstream Manufacturing Surface Treatment Electroplating Processing Fabrication Assembly Testing Final Products Downstream Final Product Die casting model manufacturing Die casting and injection molding Die manufacturing Die processing Insulator parts, rubber parts Source : Frost & Sullivan 15

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 246.0 256.7 271.0 262.2 289.7 302.9 319.0 336.3 353.4 372.1 390.7 0 200 400 2017 2018 2019 2020 2021 2022 2023E 2024E 2025E 2026E 2027E Global Market Size of Interconnect Product , 2017 - 2027E 2023E - 2027E 2017 - 2022 5.2% 4.2% CAGR US$ Billion Note : Based on retail price Source : Frost & Sullivan 16

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 2017 2018 2019 2020 2021 2022 2023E 2024E 2025E 2026E 2027E Automotive 54.1 59.0 65.0 62.6 71.3 77.0 83.5 90.9 98.3 106.3 111.7 Telecommunications 51.7 53.9 56.9 54.9 60.3 62.9 66.1 69.4 72.5 75.7 79.5 Computer 39.4 40.4 42.0 40.5 44.4 45.7 47.4 49.0 50.5 52.2 54.8 Industrial 29.5 30.2 31.2 30.0 32.7 33.2 33.8 34.7 35.5 36.4 38.2 Transportation 14.8 15.0 15.4 14.8 16.5 17.0 17.6 17.9 18.3 18.7 19.6 Others 56.6 58.1 60.4 59.4 64.4 67.1 70.6 74.4 78.3 82.9 87.0 0 50 100 150 200 250 300 350 400 450 Others Transportation Industrial Computer Telecommunications Automotive US$ Billion CAGR 2023E - 2027E 2017 - 2022 7.5% 7.3% 4.7% 4.0% 3.7% 3.0% 3.1% 2.4% 2.8% 2.9% 5.4% 3.5% Note : Based on retail price Source : Frost & Sullivan Breakdown of Global Interconnect Product Market Size by Applications, 2017 - 2027E 17

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. The Future of the Interconnect P roduct M arket • Automotive • Telecom/Data Communication • Computer and Peripheral • Industrial • Consumer Electronics Industries Expanding O pportunities in t he Automobile I ndustry • Largest End Use Industry • Highest Growth Rate due t o t he » Increasing Electronic Content in Vehicles » Increasing Need for Safety Systems » Growing Demand for Hybrid and Electric Cars Growing Demand in Automotive Sector Surge in Demand for High - frequency Interconnect Products Digitization of Interconnect Product Mobility in the Military and Defense Sectors Key Opportunities and Future Opportunities Source : Frost & Sullivan Market Drivers Analysis • Growing Demand of Infotainment and Safety Systems in the Automotive Sector. • Rising Disposable Incomes in Emerging and Developed Countries. • High Demand of Interconnect Products due to Higher Degree of Electrification in Electrical Vehicles. • The Rise of 5G. • Interconnect Products Applied to Wireless Networks can be Widely Applied in Various. Telecommunications Settings. • The Surge in Data Transmission further stimulates the Growth of the Interconnect Product Market. • High Level of Digitization in the Downstream Applications of the Interconnect Product Market. • Example: In the Automobile Industry, electrical vehicles and autopilot vehicles embed various functions » Autonomous Driving » Ai - functioned Entertainment » Personalized Experience • Increasing Demand for Miniature Electronic Sensors, Detectors, Transmitters, and Rugged Wiring that are Specifically Designed to Work in the Active Battlefield under High Shock, Vibration, and Extreme Environmental Exposures. 18

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Product Design After - sales Return/ Repair Services Product Prototyping and Development Manufacturing Scale - up Logistics Management Testing and Quality Assurance OEM Model ODM Model Interconnect Product Manufacturer Upstream - Suppliers Midstream - Contractors Downstream – End - users Manufacturers of Raw Material Interconnect Product OEM/ ODM/ EMSs Electronic products OEM/ ODM/ EMSs Brand Owners End - users Industry Value Chain Source : Frost & Sullivan Process Flow Chart of Interconnect Product Manufacturers 19

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 429.2 463.1 452.7 478.1 503.5 542.1 573.5 602.4 632.9 666.1 699.4 0.0 100.0 200.0 300.0 400.0 500.0 600.0 700.0 2017 2018 2019 2020 2021 2022E 2023E 2024E 2025E 2026E 2027E 2023E - 2027E 2017 - 2022 CAGR 5.1% 4.8% Total RMB Billion Market Size of Interconnect Product OEM Industry by Revenue in the PRC, 2017 - 2027E Note : Based on ex - factory price Source : Frost & Sullivan 20

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Upgrade Facility and Management System to Enhance Operational Efficiency and Increase Production Capacity Accelerate Our Sales a nd Marketing Efforts Continue to Invest in Research & Development and Cultivate Engineering Talents Pursue Expansion through Strategic Acquisitions and Collaboration Expand New Customer Base and Increase Product Offering to Existing Customers 21

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. Mr. Chi Man Chan (William) Chief Sale Officer Mr. Kwok Kwan Chan Chief Operation Officer Mr. Chee Hui Law Chief Financial Officer Mr. Kung Lok Chiu Chief Executive Officer and Director • Mr. Chiu has served as CEO of CCSC Interconnect HK since January 2021. • Mr. Chiu served as the Sales Director of CCSC Interconnect HK from January 2018 to December 2020. • Mr. Chiu served as the Sales Manager of CCSC Interconnect HK from April 2014 to December 2017. • Mr. Chiu holds a Bachelor’s degree in Mechanical Engineering from Loughborough University and an MBA degree from Concordia University Wisconsin. Mr. Chiu is currently pursuing a doctoral degree in Regional and Industrial Economic Management from Nanchang University . • Mr. Law has served as the CFO of CCSC Interconnect HK since January 2021. • Mr. Law served as a Director of Excellence Capital Management Limited from October 2019 to December 2020. • Mr. Law served as the CFO of State Energy International Group Ltd. from April 2019 to September 2019. • Mr. Law served as the CFO and Company Secretary of AAB International Holding Limited from September 2012 to March 2019. • Mr. Law holds a Bachelor’s degree in Accounting from the Royal Melbourne Institute of Technology University in Australia. Mr. Law is a Certified Practicing Accountant of CPA Australia and Member of Hong Kong Institute of Certified Public Accountants. • Mr. Chan has served as the COO of CCSC Interconnect HK since July 2020. • Mr. Chan served as the Executive Assistant to the General Manager of CCSC HK from February 2016 to March 2021. • Mr. Chan holds a Bachelor’s degree in Electrical and Electronics Engineering from Portsmouth University and a Master’s degree of Science in Industrial Automation from Hong Kong Polytechnic University. • Mr. Chan has served as CSO of CCSC Interconnect HK since October 2020. • Mr. Chan served as the Vice President of CCSC Interconnect HK from January 1997 to September 2020. • Mr. Chan has over 25 years of experience in sales of interconnect products . • Mr. Chan holds a High Diploma in Computer Science from Chu Hai College of Higher Education in Hong Kong. 22

Mr. Kung Lok Chiu Chief Executive Officer and Director • Mr. Chiu has served as CEO of CCSC Interconnect HK since January 2021. • Mr. Chiu served as the Sales Director of CCSC Interconnect HK from January 2018 to December 2020. • Mr. Chiu served as the Sales Manager of CCSC Interconnect HK from April 2014 to December 2017. • Mr. Chiu holds a Bachelor’s degree in Mechanical Engineering from Loughborough University and an MBA degree from Concordia University Wisconsin. • Mr. Chiu is currently pursuing a doctoral degree in Regional and Industrial Economic Management from Nanchang University . Dr. Chi Sing Chiu Founder, Chairman of the Board and Director • Dr. Chiu served as Chairman of CCSC Interconnect HK from January 2021 to September 2021. • Dr. Chiu served as the CEO of CCSC Interconnect HK from March 1993 to December 2020. • Dr. Chiu has over 30 years of experience in the interconnect products industry. • Dr. Chiu has been awarded for a Medal of Honor from Austrian Albert Schweitzer Association in June 2020 and Elite of Commerce from the Economic of French Collection Metropolis Prosperity in each of 2011 and 2012. • Dr. Chiu holds an Honorary Doctorate degree in Business Administration from Sabi University, and received a post - doctoral fellowship from California State University. Dr. Chiu is currently pursuing a doctoral degree of Regional and Industrial Economic Management from Nanchang University. Ms. Sin Ting Chiu Director Dr. Wai Chun Tsang Independent Director Nominee Dr. Tsz Fai Shiu Independent Director Nominee Mr. Kenneth Wang Independent Director Nominee Dr. Pak Keung Chan Independent Director Nominee • Ms. Chiu has served as a Director of the Company since October 2021. • Ms. Chiu served as the Manager of the finance department of CCSC Interconnect HK from May 2016 to September 2021 . • Ms. Chiu holds a Bachelor’s degree in Bioscience (Nutrition) from the University of Nottingham. • Dr. Tsang founded TWC Corporate Services Ltd in April 2000 and has since served as a Managing Director. • Dr. Tsang currently serves as a Director of ten companies, including a Hong Kong listed company, Timeless Software Ltd. • Dr. Tsang holds a Diploma in Secretarial Management from Hong Kong Baptist College, an MBA from Heriot - Watt University, an Honorary Doctorate degree in Business Administration from Sabi University in France, and a Doctorate degree from International American University. • Dr. Shiu has been working for Knowing Management Consultancy since 2005 and serves as the Principal Consultant and Training Director. • Dr. Shiu holds a Bachelor’s degree in Social Service and Social Work from Hong Kong Polytechnic University, a Master’s degree in Business Administration from Sheffield Hallam University in United Kingdom, and a Doctorate degree in Business Administration from Bulacan State University in Philippines. • Mr. Wang has served as the President of Synergy Turfs Co., Ltd. s ince September 2009 . • Mr. Wang served as the Managing Director of Best Interlink Group f rom March 1993 to September 2009 . • Mr. Wang served as the head of the Sr. technical staff of Hughes Aircraft Company in Fullerton f rom June 1981 to March 1993 . • Mr. Wang holds a Bachelor’s degree in Electrical Engineering from California State University and an MBA from the National University (La Jolla, CA). • Dr. Chan has been working as an Independent Advisor for aerospace and military industries since April 2016. • Dr. Chan served as an Emeritus Consultant to the Chairman and CEO of the Integrated Manufacturing Solutions, Greater China, from April 2015 to March 2016. • Dr. Chan served as the President, of Sanmina Corporation from March 1999 to March 2015. • Dr. Chan holds a Bachelor’s degree in Mechanical Engineering and Automation from Tianjin University; and Postgraduate degree in Applied Electronic Engineering from Hong Kong University; and Honorary Doctorate degree of Philosophy in Business Administration from Tarlac State University. Dr. Chan also received post - doctoral fellowship in Art Management and Technology from University of Quebec, and post - doctoral fellowship in Business and Technology Management from China National School of Administration. See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 23

See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. 27.2 24.1 7.5 7.9 2.3 2.2 0.0 5.0 10.0 15.0 20.0 25.0 30.0 FY2022 FY2023 Revenue Gross Profit Net Income US$ Million 27.5% 32.7% 0.0% 5.0% 10.0% 15.0% 20.0% 25.0% 30.0% 35.0% FY2022 FY2023 Gross Profit Margin Revenue, Gross Profit, and Net Income Gross Profit Margin Note : Fiscal Year Ended March 31 24

63% 31% 7% See offering documents for further risks and disclosures. There is no guarantee that any specific outcome will be achieved. I nve stments may be speculative, illiquid and there is a risk of loss. US$ Million 24.5 22.2 2.7 1.8 0.0 5.0 10.0 15.0 20.0 25.0 30.0 FY2022 FY2023 Cable and Wire Harnesses Connectors 61% 32% 7% Europe Asia Americas Revenue by Product Type 16.4 15.0 8.7 7.4 2.0 1.6 0.0 5.0 10.0 15.0 20.0 25.0 30.0 FY2022 FY2023 Americas Asia Eurpoe Revenue by Regions US$ Million FY2022 FY2023 Note : Fiscal Year Ended March 31 25

Email: ir@ccsc - interconnect.com Tel: +852 2687 0272 Address: 1301 - 03, 13/f Shatin Galleria, 18 - 24 Shan Mei St, Fotan , Shatin, Hong Kong Issuer CCSC Technology International Holdings Limited Email: contact@reveresecurities.com Tel: +1 (212) 688 - 2238 Address: 650 Fifth Avenue, 35th Floor, New York, NY 10019 USA Underwriter Revere Securities LLC