Nanchip Technology: This year, the auto electronics business has grown rapidly, with key breakthroughs in the BMS and Display Power product lines | Highlights from the earnings conference.
At the Nanxin Technology earnings conference, the director and general manager, Ruan Chenjie, stated that the BMS and Display Power product lines have achieved key breakthroughs, with strong growth momentum, and the future business scale is expected to continue to rise rapidly. Ruan Chenjie mentioned that the company's revenue and net income in the first three quarters have all exceeded last year's full-year level, and it is expected that the annual revenue and profitability situation will achieve better results.
Amlogic: It is expected that the annual revenue will increase year-on-year, with inventory consisting mainly of short-term aged products | Directly focus on the earnings conference.
①Based on the new ARM V9 architecture and self-developed edge AI capabilities, the 6nm chip of the company's next-generation product improves CPU performance by more than 60%, GPU performance by more than 230%, and reduces power consumption by 50% compared to the previous generation 12nm chip; ②This year is dedicated to improving operational efficiency for the company. A series of operational efficiency improvement initiatives have been identified, and the improvement effects will gradually be reflected in the second half of the year.
Supply is insufficient! Industry giants are operating beyond capacity and the semiconductors industry chain is expected to further recover.
According to industry media reports, taiwan semiconductor's 3nm process capacity utilization rate in the first half of next year will reach 100%, and 5nm is even hotter, with a capacity utilization rate of 101%, that is, overloaded operation. Tianfeng Securities pointed out that in recent years, the country has vigorously supported the technology industry, and our semiconductor industry chain domestication has ushered in opportunities.
[Data Analysis] Block orders of IM futures significantly increased their long positions, with funds from multiple sources joining hands to rush to subscribe to China Wafer Level CSP.
①The main contract for IM futures saw a significant increase in long positions by over 7,000 lots, with the number of additional positions clearly exceeding the short positions. ②Chip stock China Wafer Level CSP attracted institutions, speculative funds, and algo funds to buy in, with Huaxin Securities Shanghai Wanping South Road branch buying 0.26 billion.
Just ten days after the trade negotiations with Debonte technology fell through, Huawei Electronics intends to "fall" 100% equity in Huahai Chengke.
①Deppon Technology previously announced that the pricing range for the preliminary negotiation of 100% equity of Huawei Electronics is between 1.4 billion yuan and 1.6 billion yuan; ②At that time, Huawei Electronics made performance commitments, with a projected net income in 2024 of not less than 53 million yuan; ③Huawei Electronics experienced two rounds of financing, with investments from Zhejiang Business Venture Capital and Wingtech Group.
The first domestically produced independently controllable vehicle-grade MCU chip has been released, and the semiconductor industry is expected to continue growing.
On November 9, dongfeng automobile led the establishment of the Hubei Province Vehicle-Grade Chip Industry Technology Innovation Consortium to release a high-performance vehicle-grade MCU chip - DF30, filling the domestic gap. Huafu Securities stated that the semiconductor industry is growing rapidly, with revenue recovery at all levels, and driven by innovation in AI, HPC, edge AI/foldable screens, the semiconductor industry is expected to continue its growth trend.
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