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TongFu Microelectronics (002156.SZ): Plans to increase capital by 0.2 billion yuan to Xiamen TongFu.
On December 20, Ge Long Hui reported that TongFu Microelectronics (002156.SZ) announced that the company holds a 23% stake in Xiamen TongFu Microelectronics Co., Ltd. (referred to as "Xiamen TongFu"). Xiamen TongFu currently has a registered capital of 1 billion yuan (RMB, the same below), which has been fully paid. Now, due to the business development needs of Xiamen TongFu, the Board of Directors has agreed for the company to increase its capital by 0.2 billion yuan, with an increase price of 1 yuan per registered capital.
Is Tongfu Microelectronics Co.,Ltd's (SZSE:002156) Recent Stock Performance Influenced By Its Fundamentals In Any Way?
How do domestic semiconductors industry chain grow against the wind? At this closed-door event, many "little giant" companies shared their insights and advice.
① The release of a new round of export control entity lists has fostered the consensus within the industry to cultivate and develop a domestic supply chain system. ② Several emerging companies in the semiconductors field recently stated at an industry event that the domestic market for semiconductor equipment and memory chips is vast, and small and medium-sized enterprises possess the resilience for growth and development.
Here's Why Tongfu MicroelectronicsLtd (SZSE:002156) Has A Meaningful Debt Burden
Tongfu Microelectronics (002156.SZ): The company currently has no business cooperation with Nvidia.
Gelonghui November 26th | Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company is vigorously developing fan-out, wafer-level, flip-chip and other packaging technologies and expanding its production capacity; in addition, actively laying out top packaging technologies such as Chiplet, 2D+, forming a differentiation competitive advantage. As of now, the company has no related business cooperation with Nvidia.
Tongfu Microelectronics (002156.SZ): providing global customers with one-stop services from design simulation to packaging testing.
Gelonghui November 26th, Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company is an integrated circuit packaging and testing service provider, offering a one-stop service from design simulation to packaging testing for global customers. The company's products, technology, and services fully cover a wide range of areas including AI, high-performance computing, big data storage, display drivers, 5G and other network communications, information terminals, consumer terminals, internet of things, autos electronics, industrial control, meeting diverse customer needs. The company seizes market development opportunities tightly, focusing on future high-value-added products and market hotspots, with a solid foundation for long-term success.
Recent 13% Pullback Isn't Enough to Hurt Long-term Tongfu MicroelectronicsLtd (SZSE:002156) Shareholders, They're Still up 112% Over 5 Years
