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TongFu Microelectronics: 2024 Interim Performance Forecast
Tongfu Microelectronics (002156.SZ): Actively carries out domestic and foreign patent layout in multiple advanced packaging technology fields.
On July 8, GraceLink reported that Tongfu Microelectronics (002156.SZ) stated on its investor interaction platform that the company has continuously strengthened independent innovation during its development, and has actively carried out domestic and international patent layouts in multiple advanced packaging technology fields. As of December 31, 2023, the company has accumulated 1,544 domestic and foreign patent applications, with advanced packaging technology layout accounting for more than 60%.
Tongfu Microelectronics (002156.SZ): through acquisition, has formed a powerful joint venture and cooperation model with AMD.
On July 8th, GeLongHui reported that an investor asked Tongfu Microelectronics (002156.SZ) on the investor interaction platform: "Does your company have any cooperation with AMD?" The company replied that through mergers and acquisitions, they have formed a strong alliance model of "joint venture + cooperation" with AMD, established a strategic partnership and signed a long-term business agreement.
Tongfu Microelectronics Agrees to Joint Investment With CITIC Construction Investment
Tongfu Microelectronics (SHE:002156) agreed to jointly invest with CITIC Construction Investment in Xiamen Runxin Huize Investment Partnership. The partnership's total subscribed capital was 180.8 mil
Tongfu Microelectronics (002156.SZ) intends to jointly invest in a partnership enterprise with professional investment institutions.
On July 3rd, Gelunhui reported that Tongfu Microelectronics (002156.SZ) recently signed a partnership agreement with China Securities Co., Ltd. and China Securities Investment Co., Ltd. to jointly invest in Xiamen Runxin Huize Investment Partnership Enterprise (Limited Partnership). The total subscribed capital of the partnership enterprise is 180.81 million yuan. The company, as a limited partner, subscribed 100.45 million yuan with its own funds, accounting for 55.56% of the total subscribed capital of the partnership enterprise. Investment direction of the fund: carry out private equity investment, and directly or indirectly invest in the equity of semiconductor industry companies through special purpose vehicles.
Benign Growth For Tongfu Microelectronics Co.,Ltd (SZSE:002156) Underpins Its Share Price
With a price-to-sales (or "P/S") ratio of 1.6x Tongfu Microelectronics Co.,Ltd (SZSE:002156) may be sending very bullish signals at the moment, given that almost half of all the Semiconductor companie
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