Benign Growth For Tongfu Microelectronics Co.,Ltd (SZSE:002156) Underpins Its Share Price

With a price-to-sales (or "P/S") ratio of 1.6x Tongfu Microelectronics Co.,Ltd (SZSE:002156) may be sending very bullish signals at the moment, given that almost half of all the Semiconductor companie

Simply Wall StJun 23 21:44 ET

Ping An Securities: Storage and calculation will still be the main focus of the semiconductor industry, bullish on domestic substitution space in the advanced packaging industry chain.

Advanced packaging is an important technological path to address the upgraded storage and computing demand. With the recovery of the semiconductor cycle, the bottom of the packaging and testing cycle has been solidified, and a new round of growth has begun in H1 2024.

Zhitong FinanceJun 21 03:50 ET

Tongfu Microelectronics (002156.SZ): The first phase of employee stock ownership plan stocks have been sold out.

On June 19th, Geelong News reported that Tongfu Microelectronics (002156.SZ) announced that during the period from June 10, 2022 to June 19, 2024, after the expiration of each lock-up period of the first phase of employee shareholding plan, a total of 5,920,092 shares were sold through centralized bidding, accounting for 0.390% of the company's total share capital. All the held shares have been sold.

Gelonghui FinanceJun 19 05:21 ET

Tongfu Microelectronics (002156.SZ) plans to distribute 0.12 yuan per 10 shares on June 25 after ex-rights and ex-dividend.

Zhitong Finance APP news, Tongfu Microelectronics (002156.SZ) announced that the company's 2023 annual equity distribution plan: to distribute a cash dividend of 0.12 yuan (including tax) per 10 shares to all shareholders. The ex-dividend date is June 25, 2024.

Zhitong FinanceJun 18 06:02 ET

[BT Financial Report Analysis] Tongfu Microelectronics Q1 2024 comprehensive analysis: steady performance growth, strong cash flow performance.

Tongfu Microelectronics (stock code: 002156) recently released its financial report for the first quarter of 2024. As a leading enterprise in integrated circuit packaging and testing services, its performance has been well received by the market. This article will provide a detailed and in-depth analysis and discussion of Tongfu Microelectronics' balance sheet data, profit data, and cash flow data. In terms of balance sheet, as of the end of the reporting period, Tongfu Microelectronics' total assets reached 35.021 billion yuan, a slight increase of 0.41% from the end of the previous year, maintaining a stable growth trend. The total liabilities amounted to 20.2 billion yuan, and the debt-to-asset ratio was 57.68%, slightly down from the initial 57.87%.

businesstimes cnJun 18 02:13 ET

Tongfu Microelectronics (002156.SZ) is actively developing packaging technologies such as Chiplet and 2D+.

On June 13th, Gelonhui reported that Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company grasps the market development opportunities, focuses on future high value-added products and market hot spots, and takes a long-term perspective to vigorously develop packaging technologies such as fan-out, wafer-level, and inverted welding, and expand its production capacity. In addition, the company actively layouts Chiplet, 2D+ and other packaging technologies to form differentiated competitive advantages.

Gelonghui FinanceJun 13 04:00 ET