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Shenzhen Fastprint Circuit Tech (002436.SZ): FCBGA packaging substrates can be used for packaging of HBM memory, but have not yet entered the overseas HBM industry chain.
On July 22nd, Glonhui reported that an investor asked Shenzhen Fastprint Circuit Tech (002436.SZ) on the investor interaction platform, "Is the company still working with Samsung? Recently, Samsung HBM has been certified by Nvidia. Will this be bullish for the company?" The company replied that everything is normal with its cooperation with major clients. The company's FCBGA packaging substrate can be used for packaging of HBM storage, but it has not yet entered the overseas HBM leading industry chain.
Fastprint Circuit Tech's Unit Penalized Over Environmental Breaches
The environment bureau of China's Wuxi municipality penalized Shenzhen Fastprint Circuit Tech's (SHE:002436) unit, Yixing Silicon Valley Electronic Technology, for environmental breaches at its
Shenzhen Fastprint Circuit Tech (002436.SZ): has not yet collaborated with Radish Run.
On July 15th, Guolonghui reported that Shenzhen Fastprint Circuit Technology (002436.SZ) indicated on the investor interactive platform that the company has not yet cooperated with RoboKuru. The PXI series of products independently developed by the company's subsidiary, VisionTech, can be widely applicable in hardware-in-the-loop simulation testing (HIL) for automatic driving vehicle ADAS domain controllers, cockpit domain controllers, vehicle body domain controllers, chassis domain controllers, and power domain controllers. Especially in the ADAS testing aspect, it can be used for smart driving data collection and feed-back testing to test the performance of intelligent driving.
Shenzhen Fastprint Circuit Tech (002436.SZ): Large customer high-level board samples for Guangzhou FCBGA packaging substrate project have been delivered, currently in the testing phase.
On July 15th, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) said on its investor interaction platform that the first phase of investment for the FCBGA package substrate project is expected to be basically completed by the end of 2024, with subsequent investment mainly for equipment tail payments, etc. Large customer high-end board samples for the Guangzhou FCBGA packaging substrate project have been delivered and are currently in the packaging and testing stage. The drag on performance of the FCBGA packaging substrate business is mainly in terms of labor costs, depreciation, and power and material costs during the trial production period.
Shenzhen Fastprint Circuit Tech (002436.SZ): The Zhuhai factory has entered the small batch production phase of orders.
On July 11th, Glon Hui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the increase in investment in the FCBGA packaging substrate project mainly includes early-stage plant decoration, equipment investment, and progress payments for engineering. The company has signed confidentiality agreements with all cooperating customers, and the specific cooperation content of relevant customers cannot be disclosed. The FCBGA packaging substrate project is currently mainly focused on customer development, as well as technical rating, system certification, reliability verification, and product certification of relevant customers. It incurs significant costs in labor, materials, energy, depreciation, and other expenses. The company has currently passed some domestic mainstream packaging plants.
As of June 28th, the total number of shareholders in Shenzhen Fastprint Circuit Tech (002436.SZ) was more than 86,000.
On July 8th, Gelonhui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that as of June 28, 2024, the total number of shareholders in the company was more than 86,000.
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