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Shenzhen Fastprint Circuit TechLtd (SZSE:002436) Shareholders Have Earned a 8.4% CAGR Over the Last Three Years
Shenzhen Fastprint Circuit Tech (002436.SZ): The company's PCB products are used in industrial control and Siasun Robot&Automation fields.
On March 13, Glonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's products include PCBs, ATE semiconductor test boards, and IC packaging substrates, with downstream applications in the Communications, Consumer Electronics, Industrial Control, Medical, Security, and Semiconductors Industries. The company's PCB products are used in the industrial control and Siasun Robot&Automation fields, while the target customers for the IC packaging substrate business include chip design companies and packaging factories, used in areas such as CPU, GPU, FPGA, ASIC, Memory Chip, and RF chips. The application fields of chip products are determined by customers based on their own needs.
Shenzhen Fastprint Circuit Tech (002436.SZ): The company's IC packaging substrate is a core raw material for chip packaging.
On March 11, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on its investor interaction platform that the company's IC packaging substrates are the core raw materials for chip packaging. The company will cooperate with clients to improve packaging compatibility to enhance chip yield.
Shenzhen Fastprint Circuit Tech (002436.SZ): Currently has the capacity for mass production of products with up to 20 layers.
On March 11, Glenwood Holdings reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that both chip design companies and packaging manufacturers are target customers for the company's packaging substrate business. Cooperation with specific clients is not convenient to disclose due to confidentiality agreements; please refer to the announcements disclosed by the company for information. The company currently has the mass production capability for 20-layers and below products, with a minimum line width and spacing of 9/12um, and testing work for FCBGA packaging substrates over 20 layers is progressing in an orderly manner.
Track Hyper | Shenzhen Fastprint Circuit Tech ABF supply chain expansion.
A profound change is silently occurring.
Luwu Optoelectronics (688401.SH): Shenzhen Fastprint Circuit Tech and its concerted actors plan to reduce their shareholding by a total of no more than 2%.
Luwei Optoelectronics (688401.SH) announced that the company recently received notification from the Shareholder Shenzhen Fastprint Circuit Tech and its concerted action party Shenzhen Fastprint...
Shenzhen Fastprint Circuit TechLtd (SZSE:002436) Is Making Moderate Use Of Debt
