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Shenzhen Fastprint Circuit Tech (002436.SZ): The company has successfully developed samples of Glass substrates, which are currently in the technology reserve stage.
On December 27, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's Glass substrate R&D project is progressing in an orderly manner, with samples successfully developed and currently in the technology reserve stage. At present, there has not yet been large-scale commercial application in the industry.
Shenzhen Fastprint Circuit Tech (002436.SZ): Currently, the company's customers for low-altitude flying vehicle PCBs are mainly domestic.
On December 27, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the PCBs for low-altitude flying vehicles differ in materials, manufacturing processes, and technical requirements compared to traditional Autos electronic PCBs, to meet the specific needs of their respective application scenarios. Currently, the company's customers for low-altitude flying vehicle PCBs are mainly domestic.
Shenzhen Fastprint Circuit Tech (002436.SZ): Currently, the revenue from optical module Business accounts for a relatively low proportion.
On December 24, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's optical module downstream customers include first-tier manufacturers of optical modules both domestically and internationally, with a relatively low concentration, and it does not rely on a single customer. Currently, the revenue proportion from the optical module business is relatively low.
Shenzhen Fastprint Circuit Tech (002436.SZ): The company currently has mass production capabilities for products with 20 layers and below, while products with more than 20 layers are under development.
According to Ge Long Hui on December 24, Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's FCBGA packaging substrates can be used for the packaging of high-end chips such as CPUs, GPUs, FPGAs, and ASICs. The company currently has the mass production capacity for products with 20 layers or fewer, while products with more than 20 layers are under development.
Shenzhen Fastprint Circuit Tech (002436.SZ): The FCBGA packaging substrate project has passed certification from multiple clients, delivered several sample Orders, and has now entered the phase of small batch production.
On December 24, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on its investor interaction platform that the company's FCBGA packaging substrate project has passed certification from multiple clients and delivered several sample Orders, and has now entered the small-batch mass production stage. Currently, the capacity utilization rate is relatively low, and the progress of mass production mainly depends on market demand and the pace of client Order introduction.
Shenzhen Fastprint Circuit Tech (002436.SZ): The company's revenue contribution from the USA Business is relatively low, and in 2023, the proportion of the top ten customers from foreign clients in China is approximately 50%.
On December 18, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that cooperation with major clients is progressing normally, and specific client information cannot be disclosed due to confidentiality agreements. The revenue proportion of the company's USA Business is relatively low, with about 50% of the revenue from the top ten clients in 2023 coming from foreign clients in China. However, the company's clients are diversified, with a low concentration, not dependent on a single Industry or single client.
Shenzhen Fastprint Circuit TechLtd (SZSE:002436) Is Making Moderate Use Of Debt
