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Xing Sen Technology: 2024 Annual Results Forecast
Shenzhen Fastprint Circuit Tech (002436.SZ): The application fields of FCBGA packaging substrates include Servers, AI Chip, Asia Vets, Switch, and more.
Gelonghui January 15th丨Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's FCBGA packaging substrate application fields include Servers, AI Chip, Asia Vets, Switch, etc., with specific applications depending on the end customer's product application.
Shenzhen Fastprint Circuit Tech (002436.SZ): CSP packaging substrates are mainly used in areas such as storage chips and radio frequency chips.
On January 10, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's CSP packaging substrates are mainly applied in fields such as storage chips and RF chips, with clients including overseas storage customers and packaging factories. Regarding FCBGA packaging substrates, the company maintains good technical and business communication with leading overseas clients.
Shenzhen Fastprint Circuit Tech (002436.SZ): The subsidiary has received a government subsidy of 68.98 million yuan.
On January 7, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) announced that its holding subsidiary, Guangzhou Fastprint Semiconductors Co., Ltd., recently received a financial subsidy of 68.98 million yuan for the production and research and development base project of FCBGA packaging substrates, which accounts for 32.66% of the company's most recent audited Net income attributable to the listed company's Shareholders. As of the date of this announcement, the aforementioned subsidy has been fully received. This government subsidy is related to the company's daily Operation and is not sustainable.
Retail Investors Among Shenzhen Fastprint Circuit Tech Co.,Ltd.'s (SZSE:002436) Largest Stockholders and Were Hit After Last Week's 17% Price Drop
Shenzhen Fastprint Circuit Tech (002436.SZ): The company has successfully developed samples of Glass substrates, which are currently in the technology reserve stage.
On December 27, Gelonghui reported that Shenzhen Fastprint Circuit Tech (002436.SZ) stated on the investor interaction platform that the company's Glass substrate R&D project is progressing in an orderly manner, with samples successfully developed and currently in the technology reserve stage. At present, there has not yet been large-scale commercial application in the industry.
Shenzhen Fastprint Circuit TechLtd (SZSE:002436) Is Making Moderate Use Of Debt
