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shennan circuits (002916.SZ): FC-BGA package substrate has the mass production capability of 16 layers and below.
Gelonghui November 6th | Shennan Circuits (002916.SZ) held a brokerage strategy meeting on November 5, 2024, to discuss the progress made in the business of company's packaging substrate in FC-BGA technology capabilities. The company stated that its FC-BGA packaging substrate has the capacity for mass production of 16 layers and below products, and the capability for sample production of products with more than 16 layers. The certification work for the sample of the 20-layer product is progressing in an orderly manner. The company will further accelerate breakthroughs in technology capabilities for high-end products and market development, while continuing to introduce technical experts and strengthen the research and development team in this field.
shennan circuits (002916.SZ): There is still land reserve in the Nantong base, which has the conditions for building new factories.
GLENOUYI reported on November 6th that shennan circuits (002916.SZ) held a brokerage strategy meeting on November 5, 2024, regarding the question of "Please introduce if there is room for further expansion of the company's PCB business." The company stated that its PCB business has factories in Shenzhen, Wuxi, Nantong, and future projects in Thailand. On one hand, the company can enhance production efficiency by continuously upgrading and renovating existing mature PCB factories, thereby releasing a certain production capacity; on the other hand, the company still has land reserves in the Nantong base, possessing conditions for constructing new factories. The Nantong Phase Four project has been progressing in an orderly manner with csi construction & engineering index, and is planned to be developed to cover
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102884128 : getting disappointed with this counter. every day drop.