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Shennan Circuits (002916.SZ): The production and manufacturing of the company's packaging substrate does not involve downstream advanced packaging processes.
Shennan Circuits (002916.SZ) stated on the investor interactive platform on September 11th that package substrates can provide support, heat dissipation, and protection for chips, as well as electrical connections between chips and PCB motherboards, making them an indispensable component of chip packaging. CoWos technology, mentioned here, belongs to advanced packaging technology and is applied to chip packaging. The company's production and manufacturing of package substrates does not involve downstream advanced packaging processes.
Shennan Circuits (002916.SZ): The recent PCB factory utilization rate is basically flat compared to the second quarter of 2024.
Shennan Circuits (002916.SZ) stated during an investor relations event on September 3rd that the company's PCB factory has maintained a relatively stable capacity utilization rate compared to the second quarter of 2024, remaining at a high level. The capacity utilization rate of the packaging substrate factory has slightly declined due to fluctuations in downstream demand in certain areas.
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