ASMPT has a footprint in more than 30 countries around the world, and the Group continues to use its advantages in international business networks and resources to drive the growth of its main business - post-process equipment, materials and SMT solutions business segments. Established in 1975 in Hong Kong, the Group is the world's first equipment manufacturer to provide technology and solutions for all process steps of semiconductor packaging and electronic product production, from semiconductor packaging materials and post-processing (chip integration, welding, packaging) to SMT processes. No other equipment supplier in the world has a similar comprehensive product portfolio and extensive knowledge and experience in assembly and SMT procedures. The Semiconductor Solutions segment produces and provides semiconductor assembly and packaging equipment for the microelectronics, semiconductor, optoelectronics, and optoelectronics markets. It provides diversified products such as crystal fixing systems, wire welding systems, epoxy systems, cutting and molding systems, and a full range of production line equipment. The materials business produces and supplies semiconductor packaging materials, which are composed of a lead frame part and a molded interconnect substrate part. The SMT Solutions business is responsible for developing and distributing first-class DEK printers, as well as first-class SIPACESMT placement solutions for the SMT, semiconductor and solar markets. ASMPT is headquartered in Singapore and has been listed on the Hong Kong Stock Exchange since 1989.