XIAOMI-W
01810
MEITUAN-W
03690
NTES-S
09999
TRIP.COM-S
09961
TENCENT
00700
Our camera modules use “flip-chip” technology (semiconductor processor chips (generally referred to as chips) are directly attached to the substrate in an “inverted” manner) or “on-board chip” technology (using metal wire to directly mount the chip and electrically interconnect to the substrate). In 2013, it became the sixth largest supplier of camera modules in the world. With our experience and expertise in manufacturing camera modules based on COB technology, we began using advanced flip chip technology to produce fixed focus camera modules in 2012.