Jiantao Laminated Board Group established its first copper-clad panel factory in Shenzhen, China in 1988, and began producing paper-clad copper-clad panels in 1989. Since then, Jiantao Laminate Group has developed rapidly horizontally and vertically. On the horizontal side, Jiantao Laminate Group is expanding production of new copper-clad panel products, including epoxy fiberglass copper-clad panels and fire-resistant paper copper-clad panels. On the vertical side, Jiantao Laminate Group develops the production of major upstream raw materials, including copper foil, glass yarn, glass fiber cloth, bleached wood pulp paper and epoxy resin. In 1999, the copper foil business located in Fogang, China was spun off and listed on the Singapore Exchange under the name Kingboard Copper Foil. In December 2006, the Group successfully listed on the main board of the Hong Kong Stock Exchange. This development has enabled the Group to optimize economies of scale and achieve cost efficiency through vertically integrated production structures, thus becoming extremely competitive. The company currently operates more than 20 plants in South China and East China, and the strategy is to further expand its business in China to meet the growing demand for copper-clad panels and related products due to the growth of the global electronics market. The Group is an industry-leading manufacturer of vertically integrated electronic materials, focusing on the production of copper-clad panels, including epoxy fiberglass copper-clad panels, paper-coated copper-clad panels, and CEM copper-clad panels. According to Prismark Partners LLC's latest research report, the Group's share of the global copper-clad panel market reached 14.3% in 2010, ranking first in the industry for six consecutive years.
No Data