HK Stock MarketDetailed Quotes
08490 NICHE-TECH SEMI
- 0.149
- -0.011-6.88%
Not Open Nov 19 16:08 CST
105.12MMarket Cap74.50P/E (TTM)
0.164High0.148Low350.00KVolume0.160Open0.160Pre Close52.18KTurnover0.05%Turnover Ratio149.00P/E (Static)705.50MShares0.55052wk High0.48P/B105.12MFloat Cap0.12152wk Low--Dividend TTM705.50MShs Float0.730Historical High--Dividend LFY10.00%Amplitude0.121Historical Low0.149Avg Price5000Lot Size--Div YieldTTM--Div Yield LFY
About NICHE-TECH SEMI Company
Junma Semiconductor Materials was founded in 2006 and is an innovative technology company founded by Professor Zhou Zhenji and Dr. Zhou Boxuan. We serve the semiconductor and microelectronics packaging industry, focusing on developing advanced materials and introducing advanced and innovative solutions for semiconductor packaging, LED packaging and COB packaging manufacturers; we specialize in the design, production and sale of a full range of special materials such as bonding wires, encapsulated silicone, epoxy encapsulants, and adhesives.
Company Profile
Symbol08490
Company NameNICHE-TECH SEMI
ISINKYG6541R1065
Listing DateMay 30, 2018
Issue Price0.58
Shares Offered170.00M share(s)
FoundedFeb 21, 2017
Registered AddressCayman Islands
Chairmanboxuan zhou
Secretaryjianlong cai
Audit InstitutionKadoorie Certified Public Accountants Ltd
Company CategoryOther
Registered OfficeWindward 3, Regatta Office Park PO Box 1350 Grand Cayman KY1-1108 Cayman Islands
Head Office and Principal Place of BusinessRoom 208, 2nd floor, Shang Wu Building, Hong Kong Science Park Phase II, Pak Shek Kok, New Territories, Hong Kong
Fiscal Year Ends12-31
Employees189
MarketGEM
Phone(852)21153979
Fax(852)21153748
Emailinfo@nichetech.com.hk
Websitehttp://www.nichetech.com.hk
Business Junma Semiconductor Materials Co., Ltd. (former name: Junma Technology Group Co., Ltd.) is an investment holding company mainly engaged in semiconductor packaging materials business. The company is engaged in the development, production and sale of bonding wires, encapsulants and other products. Bonding wires include palladium plated copper wire, silver alloy wire, copper alloy wire, silicon aluminum wire, gold alloy wire, etc. Packaging adhesives include light-emitting diode encapsulating silicones, epoxy resins, and other products. The company also produces and sells solid crystal glues, solder materials and other products.
Company Executives
- Name
- Position
- Salary
- boxuan zhou
- Executive Director, Executive Chairman, Chairman of the Nomination Committee, Remuneration Committee Members, Authorized Representative
- 3.27M
- zhenji zhou
- Executive Director, Nomination Committee Members
- 1.86M
- yiwu shi
- Executive Director
- 741.00K
- chaofan li
- Non-executive Directors
- 140.00K
- hongwei wu
- Independent Non-Executive Director, Remuneration Committee Chairman, Audit Committee Members, Nomination Committee Members
- 140.00K
- jinjie dai
- Independent Non-Executive Director, Nomination Committee Members, Audit Committee Members, Remuneration Committee Members
- 140.00K
- lixian pan
- Independent Non-Executive Director, Chairman of the Audit Committee, Nomination Committee Members, Remuneration Committee Members
- 140.00K
- jianlong cai
- Authorized Representative, Company Secretary
- --
- yongxiang luo
- Director of R&D
- --
- peng huang
- Production Director
- --
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