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Xiamen Guang Pu Electronics (300632.SZ): As of June 20th, the total number of shareholders in the company is 16,016.
On July 15th, Gelonhui reported that Xiamen Guangpu Electronics (300632.SZ) stated on the investor interaction platform that as of June 20, 2024, the total number of shareholders in the company (excluding finance and securities lending credit accounts) was 16,016, including 14,661 individuals and 1,355 institutional accounts.
Xiamen Guang Pu Electronics (300632.SZ): Developed lidar detection sensors and TOF sensors can be widely used on low-altitude aircraft.
Xiamen Guang Pu Electronics (300632.SZ) stated on the investor interaction platform on July 15th that the company's research and development of lidar detection sensors and TOF sensors can now be widely applied to low-altitude aircraft. The company will uphold the concept of innovation and continue to develop more sensor products suitable for the low-altitude economic sector.
Some Confidence Is Lacking In Xiamen Guang Pu Electronics Co., Ltd.'s (SZSE:300632) P/E
Xiamen Guang Pu Electronics (300632.SZ) plans to increase capital by 10 million yuan to Xiamen Yiliankaitai.
Xiamen Guang Pu Electronics (300632.SZ) announced that the company intends to issue shares to Xiamen Yilianke Tai Digital Entrepreneurship Investment Partnership (Limited ...)
Xiamen Guang Pu Electronics (300632.SZ): In theory, the company's composite flow collection material products can be applied to solid state batteries in the future.
Xiamen Guang Pu Electronics (300632.SZ) stated on the investor interaction platform on June 26 that in the overall battery structure of solid-state batteries, it is still necessary to collect and transmit current with a flow collector. In theory, the company's composite collection fluid material products could be used in solid-state batteries in the future.
Xiamen Guang Pu Electronics (300632.SZ): not connected with the third phase of the national fund.
Xiamen Guang Pu Electronics (300632.SZ) stated on the investor interaction platform on June 26 that the company has made a breakthrough in the stacked packaging technology of its semiconductor optical sensors, which is a crucial technology for semiconductors. The company has not yet been connected with the third phase of the national fund.
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