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Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ): The total amount of external guarantees for which the company is responsible is approximately 2.778 billion yuan.
Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) announced that as of the date of this announcement, the company has undertaken guarantee responsibilities for external debts...
Overseas giants continue to increase investment, and Institutions expect that by 2025, the penetration of AI smartphones will further accelerate.
According to reports, Samsung continues to intensify its investment in AI smartphones, and recently the Chinese version of the Galaxy S25 series was officially released, including the S25, S25+, and S25 Ultra models. According to Canalys data, the penetration rate of AI smartphones may reach 17% in 2024, and it is expected that the penetration of AI smartphones will further accelerate in 2025.
Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ): Products have been applied in 5G Smart Phones, AIPC, AI glasses, and Other wearable devices.
On February 12, Gelonghui reported that Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) stated on the investor interaction platform that in the FPC field, the company relies on years of accumulated high-end technology for multilayer boards, and its products are now applied in 5G Smart Phones, AIPC, AI glasses, and other wearable devices.
Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ): Successfully provided a full set of circuit board solutions exclusively for Xiaomi's Iron Egg Siasun Robot&Automation.
On February 12, Glonghui reported that Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) expressed on the investor interaction platform that the company continues to pay attention to future opportunities in the Industry brought about by AI, robotics, and Brain-computer Interface. For 20 years, the company has adhered to the development of the flexible electronics industry, accumulating a large number of patented technologies in related fields. It successfully provided a full set of circuit board solutions exclusively for Xiaomi's Tiedan Robot, and the company has a relatively leading technological accumulation in this field. It will continue to pay attention to the significant opportunities brought by the development of the robotics Industry.
Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ): Currently, Alliance Communication has become a dual Elite partner in Compute and Networking with NVIDIA.
On February 12, Gelonghui reported that Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ) indicated on the investor interaction platform that Allianz Connect has now become a dual Elite level partner of NVIDIA Compute and Networking, becoming the highest-level partner in the NVIDIA GPU computing power field, with the best product technology and user service capabilities.
Xiamen Hongxin Electronics Technology Group Inc. (300657.SZ): The company is a major flexible circuit board supplier for domestic mobile phone brands such as Honor, OPPO, VIVO, and Xiaomi.
On February 10, Gelonghui reported that Xiamen Hongxin Electronics Technology Group Inc. stated on the investor interactive platform that the company is a major soft board supplier for domestic smartphone brands such as Honor, OPPO, VIVO, and Xiaomi, providing a wide range of soft board products, including those for folding devices.