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Jiangbolong (301308.SZ): The company has not engaged in specialized research and development of HBM.
On December 27, Gelonghui reported that Jiang Bolong (301308.SZ) stated on the investor interaction platform that currently the application of HBM product technology globally is primarily led by storage wafer manufacturers. The company is not engaged in specialized research and development of HBM. Its subsidiary, Yuancheng Suzhou, has the mass production capability for multilayer packaging and hybrid bonding packaging technology but is currently unable to produce HBM.
Benign Growth For Shenzhen Longsys Electronics Co., Ltd. (SZSE:301308) Underpins Its Share Price
Jiangbolong (301308.SZ): The company has terminated the issuance of convertible bonds to unspecified objects.
On December 18, Gelonghui reported that Jiangbolong (301308.SZ) announced that since the disclosure of the plan for the issuance of Convertible Bonds to unspecified entities, the company's Board of Directors, management team, and Institutions have been actively and orderly promoting various related tasks. After comprehensive consideration of changes in the external environment and the company's Global Strategy development plan, and after prudent analysis and sufficient communication and verification with the Institutions, the company has decided to terminate this issuance of Convertible Bonds.
Express News | Shenzhen Longsys Electronics Says It Plans to List in Hong Kong
Jiangbolong (301308.SZ) subsidiary Huiyi Microelectronics plans to implement Stock-based Incentive through capital increase and share expansion.
Jiangbolong (301308.SZ) announced that its subsidiary, Huixi Microelectronics (Shanghai) Co., Ltd. (referred to as 'Huixi...'
Shenzhen Longsys Electronics Co., Ltd. (SZSE:301308) Insiders Have Significant Skin in the Game With 51% Ownership
We Think Shenzhen Longsys Electronics (SZSE:301308) Has A Fair Chunk Of Debt
