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Jiangbolong (301308.SZ): The company has terminated the issuance of convertible bonds to unspecified objects.
On December 18, Gelonghui reported that Jiangbolong (301308.SZ) announced that since the disclosure of the plan for the issuance of Convertible Bonds to unspecified entities, the company's Board of Directors, management team, and Institutions have been actively and orderly promoting various related tasks. After comprehensive consideration of changes in the external environment and the company's Global Strategy development plan, and after prudent analysis and sufficient communication and verification with the Institutions, the company has decided to terminate this issuance of Convertible Bonds.
Express News | Shenzhen Longsys Electronics Says It Plans to List in Hong Kong
Jiangbolong (301308.SZ) subsidiary Huiyi Microelectronics plans to implement Stock-based Incentive through capital increase and share expansion.
Jiangbolong (301308.SZ) announced that its subsidiary, Huixi Microelectronics (Shanghai) Co., Ltd. (referred to as 'Huixi...'
Shenzhen Longsys Electronics Co., Ltd. (SZSE:301308) Insiders Have Significant Skin in the Game With 51% Ownership
Jianglong (301308.SZ): Currently unable to produce HBM
December 4th, Geelonghui (301308.SZ) stated on the investor interaction platform that the company is currently not engaged in specific research and development of HBM. The company's subsidiary, Yuancheng Suzhou, has the mass production capacity of wafer high stack packaging, which is part of the technology related to HBM, but the company is currently unable to produce HBM.
Jiangbo Long (301308.SZ): has launched eMMC and SD card controller chips, achieving applications in tens of millions of products.
Grantsman November 25th | Jiang Bolong (301308.SZ) announced that in the self-developed small-capacity storage chip field, the company has expanded the design capabilities of small-capacity storage chips such as SLCNANDFlash, and substantially established the self-developed SLCNANDFlash storage chip design business. The products have been highly recognized by customers, and the cumulative shipment volume has exceeded 0.1 billion. At the same time, the company will use SLCNANDFlash as a starting point to gradually expand the design capabilities of MLCNANDFlash and accumulate experience in chip design and chip process realization, with the first 32Gbit2 being the beginning.
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