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Jiangbolong (301308.SZ): The vehicle-level storage products have entered the supply chain systems of multiple automakers and are widely used in mainstream auto brands such as BYD, Xiaopeng, SAIC, GAC, etc.
An investor asked on the investor interaction platform if Jiangbolong (301308.SZ) produces chips for self-driving cars. The company responded that its products are widely used in various data storage scenarios, including car-mounted monitoring, smart cockpit, advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI), and other areas of smart automobiles. The company's car-grade storage products have entered the supply chain systems of multiple automakers and are widely used in major auto brands such as BYD, Xiaopeng, SAIC, and GAC.
Jiangbolong (301308.SZ) has built a global production capacity layout that balances domestic and international production, as well as in-house and outsourced production.
An investor asked Jiangbolong (301308.SZ) on the investor interactive platform about the company's current orders and the utilization rate of its production capacity. The company replied that it has built a global production capacity layout that balances domestic and outsourced production capacity, as well as independent and outsourced production capacity, laying a solid foundation for the company's long-term development. Currently, the company's production and operation are normal, and independent production capacity is operating in an orderly manner. The utilization rate of production capacity is steadily increasing.
Does Shenzhen Longsys Electronics (SZSE:301308) Have A Healthy Balance Sheet?
David Iben put it well when he said, 'Volatility is not a risk we care about. What we care about is avoiding the permanent loss of capital.' So it might be obvious that you need to consider debt, whe
As of June 20th, the total number of shareholders in Jiangbolong (301308.SZ) is 33,816.
On June 21st, Gelonhui reported that as of June 20, 2024, the company had a total shareholder count of 33,816 (including credit accounts) on the investor interaction platform.
Jiangbolong (301308.SZ): Does not have mature technology for CoWos.
On June 19th, Glonui reported that Jiang Bolong (301308.SZ) stated on the investor interaction platform that CoWoS (Chip-on-Wafer-on-Substrate) is a type of 2.5D packaging technology. This technology allows several small chips (or known as bare chips) to be packaged onto one substrate, achieving higher integration, enhanced chip interconnectivity, and lower power consumption. CoWos is primarily developed by Taiwan Semiconductor and is currently used in the field of storage chip packaging, mainly applied to HBM products and also used in CPUs/GPUs. However, for the company's main involvement in NAND.
Jiangbolong (301308.SZ): No products above GDDR6 are currently involved.
On June 12th, Gelunhui reported that Jiangbolong (301308.SZ) has currently established a layout of memory products including LPDDR4\LPDDR5, DDR4\DDR5, DDR4 RDIMM\DDR5 RDIMM, and CXL2.0 memory expansion modules, but has not yet involved products above GDDR6. The company will continue to follow the market trends, evaluate the direction of future technological development, and launch new products at the appropriate time to meet market demand.
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