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Si-tech (301568.SZ): The products are mainly used in the quality inspection process of the surface mount technology production lines for printed circuit boards in the electronic assembly field.
On January 13, Gelonghui reported that Sitaike (301568.SZ) stated on the investor interaction platform that the core technologies used in the company's machine vision inspection products, the 3D solder paste inspection equipment (3D SPI) and the 3D automated optical inspection equipment (3D AOI), are independently developed by the company. The products are mainly applied in the quality inspection stage of surface mount technology production lines for printed circuit boards in the electronic assembly field, covering end product areas including Consumer Electronics, Automotive Electronics, Lithium Battery, Semiconductors, and Communications Equipment.
Xiamen Sinic-Tek Intelligent Technology Co., Ltd.'s (SZSE:301568) Dismal Stock Performance Reflects Weak Fundamentals
Sitaek (301568.SZ): First buyback of 0.2883 million shares involving 9.904 million yuan.
On January 2, Gelonghui reported that Sitaike (301568.SZ) announced that on December 31, 2024, the company will use its own funds to implement the first share buyback through a dedicated securities account via centralized bidding. The number of shares repurchased is 0.288349 million shares, accounting for 0.28% of the company's current total equity (not deducting shares in the company's repurchase dedicated securities account), with a highest Fill Price of 34.60 yuan/share, a lowest Fill Price of 34.09 yuan/share, and a total payment amount of 9.904 million yuan (excluding stamp duties, transaction commissions, and other transaction costs).
STEK (301568.SZ): 3D SPI and 3D aoi can be used for the detection of chip solder balls and solder paste in the automotive-grade semiconductor back-end packaging process.
On December 10th, Gelonghui reported that Sitake (301568.SZ) stated on an investor interaction platform that the company's independently developed Machine Vision inspection equipment 3D SPI and 3D AOI can be used for chip solder ball and solder paste inspection in the automotive-grade Semiconductors back-end packaging process.
Sitaike (301568.SZ): plans to use no more than 0.45 billion yuan of idle self-owned funds for cash management.
Glory Exchange reported on December 9 that SiTech (301568.SZ) announced that the third board of directors' sixteenth meeting and the third board of supervisors' twelfth meeting will be held on December 9, 2024, to review and approve the "Proposal on Using Idle Self-owned Funds for Cash Management." The company agrees to use idle self-owned funds for cash management not exceeding 450 million yuan (inclusive) within 36 months from the date of approval by the company's shareholder meeting. Within the limits and time frame mentioned above, funds can be used in a revolving manner. These matters still need to be submitted to the company's shareholder meeting for review.
SITEC (301568.SZ): plans to postpone the "SITEC Technology Park Project" until December 31, 2025.
On December 9, Gelonghui reported that Sitek (301568.SZ) announced the convening of the 16th meeting of the third board of directors and the 12th meeting of the third supervisory board on December 9, 2024, where they respectively reviewed and approved the "Proposal for the Extension of Certain Fundraising Project Timelines." They agreed to extend the expected date for the "Sitek Technology Park Project" to reach usable status to December 31, 2025, without changing the implementation entity, use of raised funds, or investment scale of the fundraising projects, based on the current actual progress of the fundraising projects. The above matters do not involve changes to the use of raised funds and do not require submission for public review.
