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Is Xiamen Sinic-Tek Intelligent Technology Co., Ltd.'s (SZSE:301568) Recent Stock Performance Influenced By Its Fundamentals In Any Way?
STC (301568.SZ): Its machine vision inspection equipment can be applied to quality inspection links in the manufacturing process of emerging consumer products such as AR and VR.
On August 14th, Glonhui reported that SITC(301568.SZ) stated on the investor interaction platform that the company's machine vision inspection equipment (3D SPI and 3D AOI) can be used for quality inspection in the production process of emerging consumer products such as AR and VR. Shitan Technology, a company invested by the company in Shenzhen, can provide one-stop Micro LED technology solutions for AR/XR, wearable devices, and automotive displays. For specific details, please refer to the company's relevant announcements. In the future, the company will jointly lay out with Shitan Technology in this field, give full play to the advantages of both sides, and develop together.
Sitaik (301568.SZ): Its visual inspection equipment can be used to detect the solder balls and solder paste of chips in the HBM post-packaging process.
On August 5th, Gelunhui reported that Cetech (301568.SZ) stated on the investor interaction platform that HBM technology is a high-end combination of memory chip design technology and memory packaging technology. The company's vision inspection equipment (3D SPI and 3D AOI) can be used to detect chip solder balls and solder paste in the HBM post-packaging process.
SITAC(301568.SZ): 3DSPI and 3DAOI can be used for the detection of LED chip solder paste solder joints and the detection of chip solder balls and solder paste during the back-end packaging process of semiconductors.
On July 30, Gelunhui reported that Sitak (301568.SZ) stated on the investor platform that its 3DSPI (3D solder paste printing inspection equipment) and 3DAOI (3D automatic optical inspection equipment) can be used for testing LED chip solder paste points and semiconductor post-packaging processes, including the detection of chip solder balls and solder paste.
The Recent CN¥489m Market Cap Decrease Is Likely to Have Disappointed Insiders Invested in Xiamen Sinic-Tek Intelligent Technology Co., Ltd. (SZSE:301568)
SITRI (301568.SZ) covers a wide range of end products, including consumer electronics, automotive electronics, lithium batteries, semiconductors, and communications equipment industries.
On June 7, Gelonhui learned that Catech (301568.SZ) said on the investor interaction platform that the company's subsidiary products, 3D solder paste printing inspection equipment (3D SPI) and 3D automatic optical inspection equipment (3D AOI), are mainly used for quality inspection in the surface mounting technology production line of printed circuit boards in the electronic assembly field. The end-product areas covered are extensive, including consumer electronics, autos, lithium batteries, semiconductors, and communications equipment industries.
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