About HuangShan Googe Company

The predecessor of the company was “Huangshan Gujie Cooling Technology Co., Ltd.” which was founded in June 2012, and the overall restructuring was changed and established as a joint stock company in September 2022. The company is a national high-tech enterprise specializing in R&D, manufacturing and sales of power semiconductor module cooling substrates. It has successively been recognized as a specialized new competitor enterprise in Anhui Province, the first batch of superior enterprises in the NEV and intelligent connected vehicle industry in Anhui Province, a national-level specialized and innovative “little giant” enterprise, and a demonstration enterprise for technological innovation in Anhui Province, and has a provincial enterprise technology center. Engaged in the R&D, production and sale of power semiconductor module heat dissipation substrates, copper pin heat dissipation substrates have a pin-fin structure, which greatly increases the heat dissipation surface area, enables power modules to form a pin-like direct cooling structure, effectively improves module heat dissipation performance, and promotes miniaturization of power semiconductor modules. Since power semiconductor modules used in NEV motor controllers have high requirements for heat dissipation efficiency and miniaturization, this product has been widely used in the field of new energy vehicles. This product is the company's core product. A flat bottom heat dissipation board is a general heat dissipation structure for power semiconductor modules in the traditional field. Its main function is to transfer module heat outward and provide mechanical support for the module. This product is traditionally used in industrial control and other fields, and is currently also used in emerging fields such as new energy power generation and energy storage.