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List of cloud breakout stocks (Part 1) [Ichimoku Kinko Hyo Cloud Breakout Stock List]
List of high-flying stocks: Market Code Stock Name Closing Price Leading Span A Leading Span B TOPIX\t\t<1719> Ando Hazama\t 1195\t\t1145.75\t\t1194.5\n \t<1773> YTL\t\t\t 129\t\t123.75\t\t115.5\n \t<1941> Chuden Kogyo\t 3210\t\t3162.5\t\t3205.5\n \t<1961> Main Board
List of converted stocks (Part 2) [List of converted stocks for Parabolic Signal]
List of sell conversion stocks market code stock name closing price SAR Tokyo Prime <1414> Showa Bond 5709 5876 <1417> Miraito One 2098 2122 <1885> Toa Construction 1029 1045 <1982> Hibiya Settoku 3460 3790 <2127> Japan M&A 821 87
Tokyo Ohka Kogyo To Go Ex-Dividend On June 27th, 2024 With 29 JPY Dividend Per Share
June 26th (Japan Standard Time) - $Tokyo Ohka Kogyo(4186.JP)$ is trading ex-dividend on June 27th, 2024.Shareholders of record on June 30th, 2024 will receive 29 JPY dividend per share. The ex-dividen
Part 2 of previous day's moving stocks include Miyoshi Oil & Fat, Qualipps, Sanbio, etc.
Stock name <Code> 25-day closing price ⇒ Day-on-day comparison Laser Tech <6920> 35260 -1160 Semiconductor-related representative stocks are generally cheap. Tokyo Ohka Kogyo <4186> 4280 -130 Selling spreads as part of the semiconductor-related market. Vision <9416> 1217 -1 Significantly higher on the performance and dividend estimates revision on the 24th. Tokyo Electron Ltd. unsponsored ADR <8035> 34400 -590 SEMICONDUCTOR Manufacturing equipment is generally cheap due to the significant drop in the US SOX index. Renesas Electronics
Carbon Xtract and TOK Partner for Direct Air Capture System Development
Carbon Xtract (TYO:4186) and Tokyo Ohka Kogyo have signed a joint agreement to develop a Direct Air Capture (DAC) system using gas separation membranes, according to its filing on Friday. TOK will foc
The AI boom is accelerating the demand for memory chips.
Artificial Intelligence (AI) is seeking further high-speed semiconductors, but the cost of achieving it continues to rise. Therefore, advanced packaging is reported to be the latest focus in the semiconductor industry. Japan's semiconductor manufacturing equipment manufacturers, such as DISCO <6146>, and many other companies are said to be benefiting from it, according to the US paper WSJ. <6146> DISCO <6832> Aoi Electronics <7735> SCRE
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