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shengyi technology (600183.SH): has been mass applied in Wire Bond packaging substrate products.
On November 20, Gelonghui reported that shengyi technology (600183.SH) stated on the investor interaction platform that the company had made relevant technological arrangements in substrate materials for packaging substrates at an earlier stage, benchmarking against international leading enterprises in this field, covering different material technology routes, and developing exclusive substrate materials in collaboration with end-users. Different packaging forms have different material requirements; we have already seen mass application of Wire Bond type packaging substrate products, mainly used in the fields of sensors, card types, RF, cameras, fingerprint recognition, storage, and other product areas, and they have already seen mass application in advanced packaging fields.
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