China Wafer Level CSP (603005.SH) plans to set up a wholly-owned subsidiary in Malaysia with an investment of 50 million US dollars.

On June 27, Gelunhui reported that China Wafer Level CSP (603005.SH) intends to establish a wholly-owned subsidiary in Malaysia (hereinafter referred to as the "Malaysian subsidiary") through its Singapore subsidiary OPTIZ PIONEER in response to the development trend of the integrated circuit industry, promoting the company's market development, project expansion and global production. The aim is to build a company's overseas production base, enhance the company's production and manufacturing, and technology service capabilities, better serve the overseas market and customer needs, achieve sustained growth of the company's business, effectively promote the company's international market expansion, technology research and development, and global production investment.

Gelonghui FinanceJun 27 03:43 ET

China Wafer Level CSP Co., Ltd.'s (SHSE:603005) 25% Jump Shows Its Popularity With Investors

China Wafer Level CSP Co., Ltd. (SHSE:603005) shareholders would be excited to see that the share price has had a great month, posting a 25% gain and recovering from prior weakness. Notwithstanding

Simply Wall StJun 21 19:58 ET

China Wafer Level CSP Co., Ltd.'s (SHSE:603005) Stock Has Seen Strong Momentum: Does That Call For Deeper Study Of Its Financial Prospects?

China Wafer Level CSP's (SHSE:603005) stock is up by a considerable 11% over the past month. We wonder if and what role the company's financials play in that price change as a company's long-term fu

Simply Wall StJun 17 21:28 ET

China Wafer Level CSP's (SHSE:603005) Five-year Total Shareholder Returns Outpace the Underlying Earnings Growth

The most you can lose on any stock (assuming you don't use leverage) is 100% of your money. But on the bright side, if you buy shares in a high quality company at the right price, you can gain well o

Simply Wall StMay 24 18:09 ET

Jingfang Technology (603005.SH): Self-developed glass substrates with many years of mass production experience in packaging processes such as Fanout

Gelonghui, May 23丨Jingfang Technology (603005.SH) said on the investor interactive platform that the company focuses on wafer-level packaging technology services in the sensor field. TSV, TGV, etc. are the main technical process methods for wafer-level packaging electrical interconnection. Combining sensor requirements and its own process accumulation, the company has diverse glass processing technologies, including manufacturing microstructures, optical structures, coatings, through-holes, blind holes, etc., and has many years of mass production experience in packaging processes such as Fanout.

Gelonghui FinanceMay 23 04:07 ET

Jingfang Technology (603005.SH) will distribute 0.046 yuan per share in 2023. The stock registration date is May 23

Zhitong Finance App News, Jingfang Technology (603005.SH) announced that the company will implement the 2023 equity distribution, with a cash dividend of 0.046 yuan (tax included) per share. The share registration date is May 23.

Zhitong FinanceMay 17 05:41 ET