About China Wafer Level CSP Company

The company is dedicated to developing and innovating new technologies to provide customers with reliable, compact, high-performance and cost-effective semiconductor packaging mass production service providers. Jingfang Technology's CMOS image sensor wafer-level packaging technology has completely changed the world of packaging, making high-performance, compact mobile camera modules possible. This value has made it the most widely used packaging technology in history. Today, nearly 50% of image sensor chips can use this technology, and it is widely used in various electronic products such as smartphones, tablets, and wearable electronics. The company mainly focuses on packaging testing business in the field of sensors. The company mainly includes image sensor chips, biometric identification chips, MEMS chips, one-stop optical devices, and wafer-level optical microdevices.