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China Wafer Level CSP (603005.SH): Packaging-related products are widely used in Smart Automobile, Security monitoring, AI glasses, Siasun Robot&Automation, and many other fields.
On March 11, Longhui reported that China Wafer Level CSP (603005.SH) stated on the investor interaction platform that the company focuses on advanced packaging services for Integrated Circuits and is a leader in wafer-level TSV packaging technology in the sensor field. The packaged products include image sensor chips, MEMS chips, RF chips, and related products are widely used in Smart Automobile, Security monitoring, AI glasses, Siasun Robot&Automation, and many other fields.
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