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There's Been No Shortage Of Growth Recently For China Wafer Level CSP's (SHSE:603005) Returns On Capital
China Wafer Level CSP (603005.SH): The repurchase has been completed, with an actual repurchase of 0.11% of the company's shares.
China Wafer Level CSP (603005.SH) announced on July 30th that as of July 26th, 2024, the company has completed the buyback and actually repurchased 747,700 shares, accounting for 0.11% of the company's total share capital. The highest repurchase price was 20.62 yuan/share, which did not exceed the pre-adjustment repurchase price ceiling of 25.93 yuan/share, and the lowest price was 19.55 yuan/share. The total amount paid was 15,097,492 yuan (excluding transaction fees).
China Wafer Level CSP (603005.SH): Heterogeneous integration technology is a series of key technologies used in HBM integration applications.
On July 25th, Gelunhui reported that China Wafer Level CSP (603005.SH) stated on the investor interaction platform that TSV, Microbump, Silicon-based interposer, and heterogeneous integration technologies are a series of key technologies used in HBM integration applications. The company focuses on wafer-level TSV and other related advanced packaging technologies and is actively focusing on expanding and enhancing its own technology.
China Wafer Level CSP (603005.SH): First buyback of 0.5 million shares, involving 10.1887 million yuan.
On July 25, Gelunhui reported that China Wafer Level CSP (603005.SH) announced that from July 24th to 25th, 2024, the company repurchased 0.5 million shares of its shares through centralized bidding, and the repurchased shares accounted for 0.08% of the total share capital of the company. The highest and lowest prices purchased were 20.62 yuan/share and 20.00 yuan/share, respectively. The total amount paid was RMB 10,188,669 (excluding transaction fees). This buyback program complies with relevant laws and regulations as well as the company's buyback plan requirements.
China Wafer Level CSP (603005.SH): Shareholder, Zhongxin Chuangtou, plans to reduce their shareholding by no more than 2%.
China Wafer Level CSP (603005.SH) announced that a shareholder, Suzhou Industrial Park Creative Venture Investment Co., Ltd. (hereinafter referred to as "CICV"), plans to reduce its shareholdings by no more than 13,043,400 shares, or 2% of the total share capital of the company, through bulk trade from August 15, 2024 to November 14, 2024. (If there are changes in the number of shares due to stock dividends, capital reserve funds transfer, or other share changes during the share reduction plan implementation period, the number of shares to be reduced will be adjusted accordingly.)
China wafer level csp (603005.SH): The related products are currently widely used in smart phones, digital security monitoring and other IOT applications.
China Wafer Level CSP (603005.SH) said on its investor interactive platform that the company's packaged products include imaging sensor chips, biometric identification chips, MEMS chips, radio frequency chips, etc., and related products are widely used in smart phones, security monitoring digital products and other IoT, automotive electronics, medical and other terminal markets, including self-driving cars and other application areas. With the rapid development of new application markets such as self-driving and intelligent driving, the demand for sensor markets represented by imaging sensor chips will also show a rapid growth trend.
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